The Effects of Gallium Additions on the Microstructure of Lead-Free Solder Materials: A Short Review

Abstract:

This paper reviews the results of gallium (Ga) additions on the properties of Lead (Pb)-free solder alloys in terms of the solderability, microstructure and mechanical properties. Throughout the review, it is proven that when 0.5% of Ga is added, the shear force is improved and the grain size of the solder has refined remarkably. Besides, the addition of Ga has significantly suppressed the interfacial intermetallic compounds (IMCs) formation at solder/Copper substrate interface. This is caused by the formation of the Cu₂Ga phase around the joint surface during solidification which decrease the growth rate of the IMCs layer. In fact, the enhancement in the mechanical aspect can also be affiliated with the improvement of the IMCs of the solder due to the addition of Ga. Moreover, Ga element also added to act as solid solution strengthening in β-Sn matrix. Furthermore, the addition of Ga element definitely decreases the melting temperature of Pb-free solder in Sn-0.7Cu Pb-free solder. As Ga addition also improve the oxidation resistance and reduce the surface tension of the solder, thus the solderability of the Pb-free solder alloys is slightly improved.

• Periodical: Solid State Phenomena (Volume 280)
• Pages: 187-193
• DOI: https://doi.org/10.4028/www.scientific.net/SSP.280.187
• Online since: August 2018
• Authors: S.F. Nazri, Mohd Arif Anuar Mohd Salleh
• Keywords: Gallium (Ga), Lead (Pb)-free Solder Alloys, Materials Engineering, Microalloying, Microstructure, Solder Alloy, Solder Materials, Soldering

References

[1] M. A. A. Mohd Salleh, C. M. Gourlay, J. W. Xian, S. A. Belyakov, H. Yasuda, S. D. McDonald and K. Nogita, Scientific Reports Vol 7, Article number: 40010, (2017).

[2] S.A. Musa, M.A.A Mohd Salleh and N. Saud: Advan. Mater. Res. Vol 795, (2013), pp.518-521.

[3] M.A.A Mohd Salleh, S.D. McDonald and K. Nogita: App. Mech. Mater. Vol 421, (2013) pp.260-266.

[4] T. Xin: China Population, Resour. Environ. Vol 17, (2007), pp.66-77.

[5] M.A.A Mohd Salleh, S.D. McDonald, Y.Terada and K.Nogita: Mater. & Design. Vol 82, (2015), pp.136-147.

[6] W.R. Osório, L.C. Peixoto, L.R. Garcia, N. Mangelinck-Noël and A. Garcia: J. Alloys Comp. Vol 572, (2013), pp.97-106.

DOI: 10.1016/j.jallcom.2013.03.234

[7] Y.C. Chan and D. Yang: Prog. Mater. Sci. Vol 55, (2010), p.428–475.

[8] M. Abtew and G. Selvaduray: Mater. Sci. Eng. R. 271, (2000), p.95–141.

[9] M.A.A Mohd Salleh, M.H. Zan@Hazizi, Z.A. Ahmad, K. Hussin and K.R. Ahmad: Advan. Materi. Res. Vol 277, (2011), pp.106-111.

[10] K.N. Tu, H.-Y. Hsiao and C. Chen: Microelectron. Reliab. Vol 53, (2013), p.2–6.

[11] F. Wang, X. Ma and Y. Qian: Scripta Mater. Vol 53, (2005), p.699–702.

[12] M.G. Cho, S.K. Kang, S.-K. Seo, D.-Y. Shih and H.M. Lee: J. Electron. Mater. Vol 38, (2009), p.2242–2250.

[13] G. Melcioiu, V.A. Serban, M. Ashworth, C. Codrean, M. Li ̧ta ̆ and G.D. Wilcox: in Solid State Phenomena, (Trans Tech Publication 2014).

[14] E. Iver, A. Boesenberg, J. Harringa, D. Riegner, A. Steinmetz and D. Hillman: J. Electron. Mater. Vol 41, (2012), p.390–397.

[15] H. Ye, S. Xue and M. Pecht: J. Mater. Res. Vol 27, (2012), p.1887–1894.

[16] M.S. Park and R. Arro ́yave: Acta Mater. Vol 60, (2012), p.923–934.

[17] H. Lin, C. Lu, C. Liu, C. Chen, D. Chen, J.-C. Kuo and K.N. Tu: Acta Mater. Vol 61, (2013), p.4910–4919.

[18] J. Koo, J. Chang, Y.W. Lee, S.J. Hong, K.-S. Kim and H.M. Lee: J. Alloys Compd. Vol 608, (2014) p.126–132.

[19] L. Yang, Y. Zhang, J. Dai, Y. Jing, J. Ge and N. Zhang: Mater. Des. Vol 67, (2015), p.209–216.

[20] J. Shen, Y. Pu, D. Wu, Q. Tang and M. Zhao: J. Mater. Sci. Mater. Electron. Vol 26, (2015), p.1572–1580.

[21] F. Somidin, M.A.A. Salleh and K. Rafezi, Advan. Mater. Res. Vol 620, (2013), pp.105-111.

[22] D.X. Luo, S.B. Xue and Z.Q. Li: J Mater Sci: Mater. Electron. Vol 25, (2014) p.3566–3571.

[23] H.J. Caul, D.L. Smith and J. Am. Dent. Assoc. Vol 53, (1956), p.3–315.

[24] T.C. Hsuan and K.L. Lin: J. Alloys Compd. Vol 409, (2009), p.350.

[25] K.I. Chen and K.L. Lin: J. Electron. Mater. Vol 32, (2003)
, p.10–1111.

[26] K.I. Chen, S.C. Cheng, C.H. Cheng, S. Wu, Y.L. Jiang and T.C. Cheng: Adv. Mater. Sci. Eng. 2014, 1 (2014).

[27] W.X. Chen, S.B Xui, H. Wang, J.X Wang, Z.J. Han and J. Mater Sci: Mater Electron. Vol 21, (2010) p.496–502.

[28] G. Zeng, Stuart D. McDonald, D. Mu, Y. Terada, H. Yasuda, Q. Gu, M.A.A. Mohd Salleh and K. Nogita: J. Alloys Comp, Vol 685, (2016), pp.471-482.

[29] H.W. Wang, J.S. Fang, Z.Q. Xu and X.P. Zhang: J. Mater Sci: Mater Electron. Vol 26 (2015) p.3589–3595.

[30] Q.K. Zhang, W.M. Long, X.Q. Yu, Y.Y. Pei and P.X. Qiao: J. Alloys Compd. Vol 622, (2015), p.973–978.