The Effect of Thermal Aging on Nano-Particle Removal

Yeoho Kim; Seung Wan Jin; Hyun Tae Kim; Tae Gon Kim; Kyu Hwang Won; Jin Goo Park

doi:10.4028/www.scientific.net/SSP.314.228

Paper Titles

Study on Uniform Deposition on 300 mm Silicon Wafer with Sub-100 nm Sized Particles for Cleaning Application
p.209

Ultrafine Particle Removal in the Wafer Cleaning Process Using an Aqueous Solution with a High Concentration of Dissolved O₃ and HF
p.214

Particle Removal in Ultrasonic Water Flow Cleaning Role of Cavitation Bubbles as Cleaning Agents
p.218

Scalable Particle Removal for sub-5 nm Nodes
p.222

The Effect of Thermal Aging on Nano-Particle Removal
p.228

Contact Vs. Non-Contact Cleaning: Correlating Interfacial Reaction Mechanisms to Processing Methodologies for Enhanced FEOL/BEOL Post-CMP Cleaning
p.237

Effect of Viscosity on Ceria Abrasive Removal in the Buffing CMP Process
p.247

Nodule Deformation of PVA Roller Brushes on a Rotating Plate: Optimum Cleaning for Nanosized Particles due to Liquid Absorption and Desorption of Sponge Deformation
p.253

Mechanism of PVA Brush Loading with Ceria Particles during Post-CMP Cleaning Process
p.259

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The Effect of Thermal Aging on Nano-Particle Removal

Abstract:

The cleanness of the wafer backside is vital in improving process quality and device yield for advanced technology nodes, 10, 7 nm, and beyond [1,2]. Defects such as particles and scratches on the wafer backside could be sources of local deformation of a wafer [2], causing the photolithography hotspot generation [3], the local variation of film thickness, wafer breakage, so on. The micron-size particle defects are easily generated during deposition, etch, CMP processes, and they can be easily transferred to subsequent processing tools. The particles will be exposed to various process conditions such as high compressive stress and high temperature, and it can be seen on the end-effector and wafer chuck in the process chamber. In order to make the wafer backside clean, we need to understand the behavior of particle adhesion and removal, especially at high temperature. In this paper, the adhesion behavior of aged particles at high temperature and the footprint of them were studied.

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Periodical:

Solid State Phenomena (Volume 314)

Pages:

228-233

DOI:

https://doi.org/10.4028/www.scientific.net/SSP.314.228

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Online since:

February 2021

Authors:

Yeoho Kim*, Seung Wan Jin, Hyun Tae Kim, Tae Gon Kim, Kyu Hwang Won, Jin Goo Park

Keywords:

Cleaning, Footprint, Particle Defect, Thermal Aging, Wafer Backside

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References

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