Paper Titles

New Methods for Contamination Control and Dry Cleaning of Silicon Wafers
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Wafer Backside Cleaning by Twin-Fluid Flow Cleaning
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Evaluation of a Dry Laser Cleaning Process for the Removal of Surface Particles
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Dependency of Micro Particle Adhesion of Dispersive and Nondispersive Interactions Analyzed by Atomic Force Microscopy
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Integrated Cleaning: Application of Densified Fluid Cleaning (DFC) to Post-Etch Residue Removal
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Application of Microcalorimeter EDS X-Ray Detectors to Particle Analysis
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Surface Characterization in the Silicon Cleaning Process by a-UPC; Atmospheric Ultraviolet Photoelectron Counting
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Microscopic Analysis of Particle Removal by Gas/Liquid Mixture High-Speed Flow
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Kelvin-SPV Measurements of Atomically-Flat Si(111) Surfaces Contaminated with Metallic Ions
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HomeSolid State PhenomenaSolid State Phenomena Vols. 65-66Integrated Cleaning: Application of Densified...

Integrated Cleaning: Application of Densified Fluid Cleaning (DFC) to Post-Etch Residue Removal

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Abstract:

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Ultra Clean Processing of Silicon Surfaces IV

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Periodical:

Solid State Phenomena (Volumes 65-66)

Pages:

195-198

DOI:

https://doi.org/10.4028/www.scientific.net/SSP.65-66.195

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Online since:

November 1998

Authors:

V. Starov, D. Beery, Alex Kabansky

Keywords:

Post-Etch Residue Removal, Surface Preparation, Wafer Cleaning

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© 1999 Trans Tech Publications Ltd. All Rights Reserved

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