Paper Titles

A Novel Resist and Post-Etch Residue Removal Process Using Ozonated Chemistry
p.165

Post CMP Cleaning Using a Novel HF Compatible High Power Magasonic Tank
p.169

Relation between Oxide-CMP Induced Defects and Post-CMP Cleaning Strategies
p.173

Evaluation of Post Metal Etch Cleaning by Analyzing the Chemical Compositions and Distributions on the Etched Al Surface
p.177

New Methods for Contamination Control and Dry Cleaning of Silicon Wafers
p.181

Wafer Backside Cleaning by Twin-Fluid Flow Cleaning
p.183

Evaluation of a Dry Laser Cleaning Process for the Removal of Surface Particles
p.187

Dependency of Micro Particle Adhesion of Dispersive and Nondispersive Interactions Analyzed by Atomic Force Microscopy
p.191

Integrated Cleaning: Application of Densified Fluid Cleaning (DFC) to Post-Etch Residue Removal
p.195

HomeSolid State PhenomenaSolid State Phenomena Vols. 65-66New Methods for Contamination Control and Dry...

New Methods for Contamination Control and Dry Cleaning of Silicon Wafers

Article Preview

Abstract:

You might also be interested in these eBooks

Ultra Clean Processing of Silicon Surfaces IV

Info:

Periodical:

Solid State Phenomena (Volumes 65-66)

Pages:

181-182

DOI:

https://doi.org/10.4028/www.scientific.net/SSP.65-66.181

Citation:

Cite this paper

Online since:

November 1998

Authors:

G.S. Selwyn

Export:

RIS, BibTeX

Price:

Permissions CCC:

Request Permissions

Permissions PLS:

Request Permissions

Сopyright:

© 1999 Trans Tech Publications Ltd. All Rights Reserved

Share:

Citation: