Angle Resolved XPS Characterization of the Formation of Cl and Br Bonds in Poly-Silicon Etching and Its Cleaning
p.153
p.153
Dynamics of Mass Transfer on a Wafer Surface in Ozonated-Water Processing for Photoresist Removal
p.157
p.157
Construction of the Distribution System for Ozonized Water Used in the Wet Cleaning of Si Wafer Surface
p.161
p.161
A Novel Resist and Post-Etch Residue Removal Process Using Ozonated Chemistry
p.165
p.165
Post CMP Cleaning Using a Novel HF Compatible High Power Magasonic Tank
p.169
p.169
Relation between Oxide-CMP Induced Defects and Post-CMP Cleaning Strategies
p.173
p.173
Evaluation of Post Metal Etch Cleaning by Analyzing the Chemical Compositions and Distributions on the Etched Al Surface
p.177
p.177
New Methods for Contamination Control and Dry Cleaning of Silicon Wafers
p.181
p.181
Wafer Backside Cleaning by Twin-Fluid Flow Cleaning
p.183
p.183
Post CMP Cleaning Using a Novel HF Compatible High Power Magasonic Tank
Abstract:
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Info:
Periodical:
Solid State Phenomena (Volumes 65-66)
Pages:
169-172
Citation:
Online since:
November 1998
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Сopyright:
© 1999 Trans Tech Publications Ltd. All Rights Reserved
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