Wet Metal Etching for Ti/Co Self-Aligned Silicides
p.131
p.131
Post-Titanium-Salicide Cleaning with Spray Technology
p.135
p.135
XPS Study of the Cleaning Efficiency by Ozone Processes of the Protective Films Formed by Reactive Ion Etching of Co and Ti Silicide
p.139
p.139
Plasma Etch Residue and Photoresist Removal Utilizing Environmentally Benign Process Chemicals
p.143
p.143
Angle Resolved XPS Characterization of the Formation of Cl and Br Bonds in Poly-Silicon Etching and Its Cleaning
p.153
p.153
Dynamics of Mass Transfer on a Wafer Surface in Ozonated-Water Processing for Photoresist Removal
p.157
p.157
Construction of the Distribution System for Ozonized Water Used in the Wet Cleaning of Si Wafer Surface
p.161
p.161
A Novel Resist and Post-Etch Residue Removal Process Using Ozonated Chemistry
p.165
p.165
Post CMP Cleaning Using a Novel HF Compatible High Power Magasonic Tank
p.169
p.169
Angle Resolved XPS Characterization of the Formation of Cl and Br Bonds in Poly-Silicon Etching and Its Cleaning
Abstract:
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Periodical:
Solid State Phenomena (Volumes 65-66)
Pages:
153-156
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Online since:
November 1998
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© 1999 Trans Tech Publications Ltd. All Rights Reserved
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