Determination of Moisture / Water in Semiconductor Processing Liquids On-Line with the SemiChem Process Analyzer
p.117
p.117
Evaluation of Cleaning Recipes Based on Ozonated Water for Pre-Gate Oxide Cleaning
p.119
p.119
Characterization of Emitter Interface Oxide Growth in a Vertical LPCVD Polysilicon Deposition Reactor
p.123
p.123
Nitride Strip: Phosphoric Acid Bath-Life above 100 Hours
p.127
p.127
Wet Metal Etching for Ti/Co Self-Aligned Silicides
p.131
p.131
Post-Titanium-Salicide Cleaning with Spray Technology
p.135
p.135
XPS Study of the Cleaning Efficiency by Ozone Processes of the Protective Films Formed by Reactive Ion Etching of Co and Ti Silicide
p.139
p.139
Plasma Etch Residue and Photoresist Removal Utilizing Environmentally Benign Process Chemicals
p.143
p.143
Angle Resolved XPS Characterization of the Formation of Cl and Br Bonds in Poly-Silicon Etching and Its Cleaning
p.153
p.153
Wet Metal Etching for Ti/Co Self-Aligned Silicides
Abstract:
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Periodical:
Solid State Phenomena (Volumes 65-66)
Pages:
131-134
Citation:
Online since:
November 1998
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Сopyright:
© 1999 Trans Tech Publications Ltd. All Rights Reserved
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