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Online since: November 2012
Authors: Wen Guo, De Cang Lou, Zhi Guo Wang, Yong Hong Wang
MBDA France and EADS ST developed a simple 1-D aero thermal-chemistry analysis code PUMA to provide primary analysis for scramjets such as CHAMOIS [3].
The primary network for the internal air system is determined as follows, and is shown in Figure 1.
The nodes (Ki-1, Ki, Ki+1, Ki+2) are connected by flow elements (Lj, Lj+1, Lj+2).
Reference [1] AIAA Air Breathing Propulsion Technical Committee, THE VERSATILE AFFORDABLE ADVANCED TURBINE ENGINES (VAATE) INITIATIVE, January, 2006 [2] David E.
Vol. 35, Jan. 1999, pp. 479-483 [6] P.
The primary network for the internal air system is determined as follows, and is shown in Figure 1.
The nodes (Ki-1, Ki, Ki+1, Ki+2) are connected by flow elements (Lj, Lj+1, Lj+2).
Reference [1] AIAA Air Breathing Propulsion Technical Committee, THE VERSATILE AFFORDABLE ADVANCED TURBINE ENGINES (VAATE) INITIATIVE, January, 2006 [2] David E.
Vol. 35, Jan. 1999, pp. 479-483 [6] P.
Online since: September 2017
Authors: S.V. Davydov, A.O. Gorlenko
Chemical composition of cast iron is given in Table 1.
Table 1.
The solution of this problem is possible in the following areas: 1.
References [1] M.
Friction and wear. 17 (1996) 475-479
Table 1.
The solution of this problem is possible in the following areas: 1.
References [1] M.
Friction and wear. 17 (1996) 475-479
Online since: April 2005
Authors: Gregory P. Thomes, Thomas J. Wagener, James F. Weygand
Cryogenic Aerosols
The cryogenic aerosol process [2, 9] is summarized in Figure 1.
Figure 1: Sketch of cryogenic chamber layout (left panel) and phase diagram for a 3:1 ratio of Ar:N2 cryogenic aerosol process (right panel).
The ArgonCleanTM process, with a 3:1 Ar:N2 ratio, is the most aggressive process and recommended for planar surfaces.
References [1] The International Technology Roadmap for Semiconductors: 2003, Front End Processes, Table 70, p. 18
Becker, "Compatibility of a cryogenic aerosol process on SiLK and porous MSQ," 2003 IEEE International Symposium on Semiconductor Manufacturing, Sept. 30-Oct 2, 2003, Page(s): 479-482
Figure 1: Sketch of cryogenic chamber layout (left panel) and phase diagram for a 3:1 ratio of Ar:N2 cryogenic aerosol process (right panel).
The ArgonCleanTM process, with a 3:1 Ar:N2 ratio, is the most aggressive process and recommended for planar surfaces.
References [1] The International Technology Roadmap for Semiconductors: 2003, Front End Processes, Table 70, p. 18
Becker, "Compatibility of a cryogenic aerosol process on SiLK and porous MSQ," 2003 IEEE International Symposium on Semiconductor Manufacturing, Sept. 30-Oct 2, 2003, Page(s): 479-482
Online since: June 2008
Authors: Tae Hyun Nam, Yeon Wook Kim, Sang Hoon Lee
Transformation behaviors of as-cast strips were investigated by means of DSC and the results were
shown in Fig.1.
Fig. 1 DSC curves of (a) Ti50Ni15Cu35 and (b) Ti50Ni10Cu40 alloy strip.
References [1] J.
Forum Vol. 475-479 (2005), p. 1965
Vol. 1 (1967), p. 313
Fig. 1 DSC curves of (a) Ti50Ni15Cu35 and (b) Ti50Ni10Cu40 alloy strip.
References [1] J.
Forum Vol. 475-479 (2005), p. 1965
Vol. 1 (1967), p. 313
Online since: January 2016
Authors: Emee Marina Salleh, Sivakumar Ramakrishnan, Zuhailawati Hussain
Mg is both biocompatible and biodegradable in human body fluid by corrosion, thus eliminating the need for another surgery to remove the implant [1].
An XRD pattern for the Mg-Ti alloys milled for different times is shown in Fig. 1 and obviously indicates the peaks of deformed Mg and deformed Ti at low milling time up to 5 hours.
Fig. 1: XRD patterns for (a) Mg, (b) Ti, sintered alloys after (c) 0, (d) 2, (e) 5, (f) 10 (g) 15 and (h) 30 h of milling.
REFERENCES [1] M.
Gupta, Investigation of the reactions between boron and titanium compounds with magnesium, Scripta Mater. 45 (2001) 479-486
An XRD pattern for the Mg-Ti alloys milled for different times is shown in Fig. 1 and obviously indicates the peaks of deformed Mg and deformed Ti at low milling time up to 5 hours.
Fig. 1: XRD patterns for (a) Mg, (b) Ti, sintered alloys after (c) 0, (d) 2, (e) 5, (f) 10 (g) 15 and (h) 30 h of milling.
REFERENCES [1] M.
Gupta, Investigation of the reactions between boron and titanium compounds with magnesium, Scripta Mater. 45 (2001) 479-486
Online since: July 2011
Authors: Feng Zhou Fang, Li Ping Liu, Bin Lin
The experimental setup is schematically showed in Fig.1.
Fig.1.
Other experimental conditions are listed in Table 1.
References [1] Q.X.
Ravi, Estimation of tool wear during CNC milling using neural network-based sensor fusion, Mechanical Systems and Signal Processing. 21 (2007) 466-479
Fig.1.
Other experimental conditions are listed in Table 1.
References [1] Q.X.
Ravi, Estimation of tool wear during CNC milling using neural network-based sensor fusion, Mechanical Systems and Signal Processing. 21 (2007) 466-479
Online since: January 2014
Authors: Jie Meng, Zhen Yang, Ying Wang, Hua Zhi Xie, Wen Chao Zhang, Cheng Ming He, Xiang Yang Deng, Bing Liu
Introduction
The voltage stability is the ability to keep or recover the power voltage within the limits of safety without voltage collapse after the power system suffers small or large disturbances[1].
Tab.1 The corresponding relationship of VCCT and line power in receiver system VCCT(s) Line active power(MW) VCCT margin VTTC margin 0.079 0.087 0.097 0.107 0.12 0.13 0.144 0.161 0.179 0.242 0.34 0.496 510. 495. 479. 464. 450. 434. 419. 404. 389. 345. 290. 198. -0.519 -0.379 -0.237 -0.121 0.000 0.077 0.167 0.255 0.330 0.504 0.647 0.758 -0.120 -0.093 -0.063 -0.032 0.000 0.035 0.072 0.111 0.154 0.301 0.548 1.268 Two indexes of VCCT margin and VTTC margin are defined as follows: (1) (2) The simulation result shows that when transmitted power is less than 180MW, VCCTs are basically the same no matter how large transmitted power is; when transmitted power is larger than 550MW, the voltage of receiver system will always lose stability no matter how small the failure clearing time is.
References [1] IEEE/CI GRE Joint Task Force on Stability Terms and Definition.Definition and classification of power system stability[J].IEEE Trans on Power Systems,2004,l9(2):1387- 1401
Electric Power Systems Research,1991,21(1):9-16
Automation of Electric Power System 2005.33(7): 1-5.
Tab.1 The corresponding relationship of VCCT and line power in receiver system VCCT(s) Line active power(MW) VCCT margin VTTC margin 0.079 0.087 0.097 0.107 0.12 0.13 0.144 0.161 0.179 0.242 0.34 0.496 510. 495. 479. 464. 450. 434. 419. 404. 389. 345. 290. 198. -0.519 -0.379 -0.237 -0.121 0.000 0.077 0.167 0.255 0.330 0.504 0.647 0.758 -0.120 -0.093 -0.063 -0.032 0.000 0.035 0.072 0.111 0.154 0.301 0.548 1.268 Two indexes of VCCT margin and VTTC margin are defined as follows: (1) (2) The simulation result shows that when transmitted power is less than 180MW, VCCTs are basically the same no matter how large transmitted power is; when transmitted power is larger than 550MW, the voltage of receiver system will always lose stability no matter how small the failure clearing time is.
References [1] IEEE/CI GRE Joint Task Force on Stability Terms and Definition.Definition and classification of power system stability[J].IEEE Trans on Power Systems,2004,l9(2):1387- 1401
Electric Power Systems Research,1991,21(1):9-16
Automation of Electric Power System 2005.33(7): 1-5.
Online since: December 2014
Authors: Cai Yin You, Xiao Dong Fan, Na Tian
The mass ratio of ball and mixed powder was 30:1 and steel balls with 12 mm diameter were introduced.
As shown in Fig. 1, the grain size of α-Fe is larger than the calculated value.
Reference [1] E.F.
Xie: Materials Science Forum, Vols 475-479 (2005), p.2165 [5] M.
Street: Journal of Alloys and Compounds, Vol. 240 (1996) No.1, p.200 [10] R.
As shown in Fig. 1, the grain size of α-Fe is larger than the calculated value.
Reference [1] E.F.
Xie: Materials Science Forum, Vols 475-479 (2005), p.2165 [5] M.
Street: Journal of Alloys and Compounds, Vol. 240 (1996) No.1, p.200 [10] R.
Online since: September 2016
Authors: Hong Xia Liu, Hu Shan Ma, Ke Jian Li
Convergence criteria are determined by the energy, stress and displacement of each atom, which are set as less than 1×10-4 Ha, 0.02 Ha/Å and 5×10-3Å.
Fig.1 Models for CSi (a) and SiC (b) of defects in a (6,2) SiCNT.
The Brillouin zone sampling is performed using special k points generated by the Monkhorst-Pack grid with a value of 1×1×8, which is suitable to one dimensional materials[20].
References [1] S.
Mater. 6 (2007) 479
Fig.1 Models for CSi (a) and SiC (b) of defects in a (6,2) SiCNT.
The Brillouin zone sampling is performed using special k points generated by the Monkhorst-Pack grid with a value of 1×1×8, which is suitable to one dimensional materials[20].
References [1] S.
Mater. 6 (2007) 479
Online since: May 2020
Authors: G.A. Tkachuk, O.A. Chikova, V.A. Maltsev
Pure copper is represented by UNS numbers C10100 to C13000 [1-2].
Results and Discussions Microstructure of ingot and billet of copper M2 are shown in Fig. 1.
a b c d Fig. 1.
References [1] K.J.A.
Chikova, The forming mechanism of ultradispersed phases in rapidly solidified aluminium alloys, Nanostructured Materials, 6(1-4) (1995) 477-479
Results and Discussions Microstructure of ingot and billet of copper M2 are shown in Fig. 1.
a b c d Fig. 1.
References [1] K.J.A.
Chikova, The forming mechanism of ultradispersed phases in rapidly solidified aluminium alloys, Nanostructured Materials, 6(1-4) (1995) 477-479