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Online since: May 2019
Authors: Ahmed Hassan El-Shazly, Marwa F. El Kady, Hesham Ibrahim Elqady, Abdallah Yousef Mohammed Ali, Mohamed R. El-Marghany
El-Marghany1,5,e 1Chemical and Petrochemicals Engineering Department, Egypt-Japan University of Science and Technology (E-JUST), New Borg El-Arab City, Alexandria, Egypt 2Mechanical Power Engineering Department, Faculty of Energy Engineering, Aswan University, Aswan City, Egypt 3Fabrication Technology Department, Advanced Technology and New Materials and Research Institute (ATNMRI), City of Scientific Research and Technological Applications, Alexandria, Egypt 4Faculty of Engineering, Aswan University, Aswan City, Egypt 5Mechanical Power Engineering Department, Faculty of Engineering, Mansoura University, Egypt aabdallah_yousef@aswu.edu.eg, belshazly_a@yahoo.com, cmarwa.f.elkady@gmail.com, dhesham.elqady@aswu.edu.eg, emohamed_ragab@mans.edu.eg Keywords: Double pipe heat exchanger, MgO-oil nanofluid, Computational fluid dynamics, Laminar flow.
Bahmani, et al,” Investigation of turbulent heat transfer and nanofluid flow in a double pipe heat exchanger,” Advanced Powder Technology, vol. 29, pp. 273-282, 2018
Forum, vol. 928, pp. 83-88, 2018
Forum, vol. 928, pp. 106-112, 2018
J. of Chemical Engineering, vol. 25, pp. 966-971, 2008
Online since: October 2013
This conference series provides a forum for accessing to the up-to-date knowledge from both industrial and academic worlds and allows for the free exchange of ideas and challenges faced by these two key stakeholders and encourage future collaboration between these groups.
Studies presented in this book cover these topics: Micro/Nano Materials and Films, Polymer Materials, Composites, Ceramic, Metal, Alloys and Mining Engineering, Chemical Materials, Biomaterials and Technology, Surface Engineering/Coatings, Building Materials, Construction and Architecture, Material Processing Technology, Sensors and Detecting Technology, Signal and Intelligent Information Processing, Electronic, Optoelectronic and Automation, Industrial Robotics and Mechatronics, Mechanical Design and Modeling, CAD/CAM/CAE, Product Design and Manufacture, Advanced Manufacturing Technology, Computer Applications and Mathematical Modeling, Industrial Engineering and System Analysis, Engineering Management and Engineering Education.
Online since: September 2011
Authors: Xiao Hui Zhang, Jun Jia Cui, Cheng Xi Lei, Zhong Wen Xing
Structural finite element analysis of the fixed stiffness testing instrument Xiaohui Zhang1, a , Junjia Cui2, b , Chengxi Lei1, c , Zhongwen Xing1, d 1Faculty of Mechatronics Engineering, Harbin Institute of Technology, China 2Faculty of Materials Science and Engineering, Harbin Institute of Technology, China aat_stake@163.com, bzoe122208@163.com,cchxlei@126.com ,dgchxl@hit.edu.cn Keywords: Fixed stiffness testing instrument; Finite element analysis; Automobile panel; Structural design Abstract.
Modeling The picture and engineering drawing of fixed stiffness testing instrument concluding frame, stepping motor, beams etc. was shown in Fig.1(a) and (b), and the element of which was discrete combination mapping and freedom method by ANSYS.
[3] Daniel D, Guiglionda G, Litalien P, et al: Materials Science Forum Vol. 1 (2006), p. 519-521
[4] Xing ZW, Cui JJ, Liu HS, Li CF: Advanced Materials Research.
[5] Li Dong sheng, Zhou Xian bin: Journal of Plasticity Engineering.
Online since: September 2024
Authors: Vladimir Lebedev, Maryna Cherkashyna, Alla Sokolova, Volodymyr Purys
It can be recommended for reuse in traditional fields of primary polyamide-6 to obtain engineering and technical products.
Materials Science Forum. 1038 (2021)168–174
Lecture Notes on Data Engineering and Communications Technologies. 178 (2023) 446–458
Krygina, Design And Researching Conductive Hybrid Biopolymer Nanocomposite Materials For Micro-And Nanoelectronics. 2022 IEEE 3rd KhPI Week on Advanced Technology (KhPIWeek). (2022) 1–4
ACS Sustainable Chemistry & Engineering. 7 (2019) 11004–11013
Online since: January 2012
Authors: Takayoshi Nakano, Takuya Ishimoto, Hideki Yoshikawa, Takashi Sakai, Kentaro Kawata
Regeneration of Bone Mass and Bone Quality around Implant with Grooves for Aligning Bone Cells in Rabbit Hindlimb Bones Takuya Ishimoto1,a, Kentaro Kawata1,b, Takashi Sakai2,c, Hideki Yoshikawa2,d, and Takayoshi Nakano1,e 1Division of Materials and Manufacturing Science, Graduate School of Engineering, Osaka University, 2-1, Yamada-oka, Suita, Osaka 565-0871, Japan 2Department of Orthopaedic Surgery, Osaka University Medical School, 2-2, Yamada-oka, Suita, Osaka 565-0871, Japan aishimoto@mat.eng.osaka-u.ac.jp, bkkawata@himeji.sanyo-steel.co.jp, ctsakai@ort.med.osaka-u.ac.jp, dyhideki@ort.med.osaka-u.ac.jp, enakano@mat.eng.osaka-u.ac.jp Keywords: Bone regeneration, biological apatite (BAp), apatite orientation, microbeam X-ray diffraction, transmission optical system, grooved implant, orientation and migration of cells Abstract.
Acknowledgements This work was supported by the Priority Assistance of the Formation of Worldwide Renowned Centers of Research—The Global COE Program (Project: Center of Excellence for Advanced Structural and Functional Materials Design); Grants-in-Aid for Young Scientists (S) and (B) from the Japan Society for the Promotion of Science (JSPS); and Funding Program for Next Generation World-Leading Researchers by the Ministry of Education, Culture, Sports, Science and Technology (MEXT) of Japan.
Forum Vols. 638-642 (2010), p. 576
Forum Vols. 654-656 (2010), p. 2241
Online since: February 2011
Authors: Xu Chen, Hong Gao, Jian Ma
Preparation of Composite Conductive Microspheres Used in Anisotropic Conductive Adhesive Films Jian Maa, Hong Gaob and Xu Chenc School of Chemical Engineering and Technology, Tianjin University, 300072, China ajiyexuan3@sina.com, bhgao@tju.edu.cn, cxchen@tju.edu.cn Keywords: Anisotropic Conductive Adhesive Films(ACF); Polystyrene Sphere; Chemical Plating Abstract: Polymer-based conductive adhesive materials have become widely used in many electronic packaging interconnect applications.
Forum Vol. 127(2005), p. 29-32
[2] Watanabe I, Fujinawa T, Arifuku M, Fujii M and Gotoh Y In: Proceedings of the 9th IEEE international symposium on advanced packaging materials: processes, properties and interfaces, Atlanta, GA, 2004, p 11 [3] J.
Forum Vol. 10(1995), p. 247-252.
Online since: October 2006
Authors: Joao A. Labrincha, M.J. Ribeiro, Ana M. Segadães, F. Raupp-Pereira
Labrincha1d 1Ceramics and Glass Engineering Department, CICECO, University of Aveiro, 3810 -193 Aveiro, Portugal 2UIDM, ESTG, Polytechnique Institute of Viana do Castelo, 4900 Viana do Castelo, Portugal afraupp@cv.ua.pt, bribeiro@estg.ipvc.pt, csegadaes@cv.ua.pt, djal@cv.ua.pt Keywords: extrusion; industrial wastes; ceramic properties.
Science Forum, Advanced Materials Forum III (2006), p. 1726
Online since: September 2007
Authors: Marek Skowronski, Michael J. O'Loughlin, Vijay Balakrishna, Joseph J. Sumakeris, Brett A. Hull
Balakrishna1 1 Cree, Inc. 4600 Silicon Drive, Durham, NC, 27703, USA 2 Carnegie Mellon University, Department of Materials Science and Engineering, 5000 Forbes Avenue, Pittsburgh, PA 15213, USA joe_sumakeris@cree.com Keywords: Shockley stacking faults, Bipolar power devices, Forward voltage drift, Basal plane dislocations, Threading edge dislocations, Dislocation conversion Abstract.
These advances allow us to yield Vf stable, multi-kV bipolar SiC power devices.
A very significant recent advance in bipolar SiC device technology is the discovery that the naturally preferred conversion of substrate basal plane dislocations (BPDs) into threading edge dislocations (TEDs) in epilayers can be improved to almost 100% efficiency by selectively etching the substrate prior to epilayer growth [4].
Forum Vol. 353-356 (2001), p.299. 2.
Forum Vol. 483-485 (2005), p. 965. 6.
Online since: June 2004
Authors: Sadafumi Yoshida, Shinichi Nakashima, Junji Senzaki, Yasuto Hijikata, Hiroyuki Yaguchi, K. Narita
Citation & Copyright (to be inserted by the publisher ) Characterization of electrical properties in high-dose implanted and post-implantation-annealed 4H-SiC wafers using infrared reflectance spectroscopy K.Narita 1, Y.Hijikata 1, H.Yaguchi 1, S.Yoshida 1,2, J.Senzaki2, and S.Nakashima 2 1 Department of Electrical and Electronic Systems, Faculty of Engineering, Saitama University 255 Shimo-ohkubo, Sakura-ku, Saitama-shi, Saitama 338-8570, Japan 2 Power Electronics Research Center, Nat.
Inst. of Advanced Industrial Science and Technology AIST Tsukuba Central2, 1-1-1 Umezono, Tsukuba-shi, Ibaraki 305-8568, Japan Keywords: 4H-SiC, Ion implantation, Activation anneal, Infrared reflectance spectroscopy, Hall measurements, Carrier concentration, Mobility, Crystalline damage Abstract.
Forum, Vol. 389-393, 859 (2002)
Forum, Vol. 389-393, 621 (2002) [7] H.
Online since: June 2015
Authors: Gabriel Ferro, Véronique Soulière, Davy Carole, Kassem Alassaad, Beatrice Doisneau, François Cauwet
Ferro, Advanced Functional Material, 16 (2006) 975-979
Forum 778-780 (2014) 187-192 [7] K.
Madar, Material Science Forum, 457-460 (2004) 387
Monteil, Materials Science and Engineering: B, 130 (2006) 66-72
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