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Online since: February 2008
Authors: Xian You Zhang, Ze Wu, Zhi Dong Han, Li Min Dong
Materials Vol.187 (1998), p. 129
Materials Vol.260 (2003), p. 37
Materials Vol.265 (2003), p.130
Materials Science Vol.41 (2006), p. 3867
Wang: Journal of Magnetism and Magnetic Materials Vol.195 (1999), p. 452
Online since: June 2014
Authors: Miklos Horvath, Tibor Poos
These materials stick to the wall of the dryer because of their high moisture content and they tend to cake at lower levels of moisture content.
As a result of agitation, the two materials got mixed quickly, and after a short while a granular load was produced.
D.Hicks, Water Science and Technology Vol. 22 (12) (1990) 57-63
Moon, Journal of Hazardous Materials Vol. 168 (1) (2009) 445-450
Ogada, Progress in Energy and Combustion Science Vol. 25 (1) (1999) 55-116
Online since: September 2015
Authors: Mohd Irwan Yusoff, F. Malek, Abadal Salam T. Hussain, M.S. Jawad, Nur Amira Azhar, Syed F. Ahmed, Shouket A. Ahmed, Gomesh Nair Shasidharan, Taha A. Taha, Mohd Asri Jusoh, Muhammad Irwanto Misrun
Introduction TiO2 is one of the wide band gap semiconductor materials which has been under the extensive investigation recently.
TiO2 is one of the wide band gap semiconductors of materials which have been under extensive investigations due to its application in a variety of fields.
All the materials for efficient solar cells must have their own characteristics matched with the spectrum of available light.
Yang, TiO2 Nanorods: “A Facile Size and Shape Tunable Synthesis and Effective Improve of Charge Collection Kinetics for Dye-Sensitized Solar Cells”, ACS Applied Materials & Interfaces, May (2014)
Abbas, "UAV Storage Devices Circuitry Integration With Electrical Power Generation System", International Journal of Advanced Technology in Engineering and Science (ISSN 2348-7550), Volume No.02, Issue No. 06, (June. 2014), (IIFS Impact Factor (IF) = 1.02).
Online since: June 2022
Authors: David Rabe, Eric Häntzsche, Chokri Cherif, Mir Mohammad Badrul Hasan, Yasushi Murakami, Li Min Bao, Kanji Kajiwara
Materials and Methods In this work, Toray T700SC 50 C, 12k, 800 tex was used as the “reference” virgin filament yarn.
Normally, a biaxial reinforcement material should show around 50 % of the strength of a UD-material made from the same fibres.
Environmental science & technology 51(2017)21, pp. 12727-12736 [3] Meyer, L.
Journal of Composite Materials 43(2009)9, S. 1121-1132 [4] Nahil, M.
Journal of Composite Materials 47(2013)3, S. 369-377
Online since: May 2020
Authors: Xin Ying Teng, Fan Wang, Ming Shi Li, Yun Feng
Materials Science and Engineering: A, 2001, 302(1): 37-45
Materials Science and Engineering: A, 2016, 661: 233-239
Materials Science and Engineering: A, 2005, 413: 555-560
Materials Science and Engineering: A, 2017, 692: 75-80
Journal of Materials Processing Technology, 2004, 155-156(6):1526-1531
Online since: February 2022
Authors: A.V. Sankin, Z.I. Dadasheva, V.I. Altukhov
Obtaining and modeling the properties of nanostructured materials and I - V characteristics of SiC-based Schottky diodes.
Journal of Alloys and Compounds, 889, (2022), 161743
Materials Science in Semiconductor Processing, 135, (2021), 106085
Materials, 14 (17), (2021), 5105
Journal of Materials Science: Materials in Electronics, 32 (15), (2021), 20598-20611.
Online since: September 2025
Authors: Won Jae Lee, Chae Young Lee, Gi Uk Lee, Seung Jun Lee, Su Ho Kim, Jung Woo Choi, Jong Hwi Park, Jung Gyu Kim, Kap Ryeol Ku
To ensure the competitiveness of next generation of materials, it is essential to make SiC MESFET and GaN HEMT microwave devices more suitable for a wide range of applications.
Krupka, Effect of nitrogen doping on the growth of 4H polytype on the 6H-SiC seed by PVT method, Material Science Forum 29 (2012) 717-720
Jr, Development of large diameter high-purity semi-insulating 4H-SiC wafers for microwave devices, Materials Science Forum 457-460 (2004) 35-40
Wang, Polytype stabilization of high-purity semi-insulating 4H-SiC crystal via the PVT method, ISSN 1392-1320 Materials Science Vol.22 (2016) No.2
Ku, Hydrogen effect on SiC single crystal prepared by the physical vapor transport method, Materials Science Forum 556-557 (2007) 25-28
Online since: February 2013
Authors: Hui Xu, Lan Jie Zhao, Guo Hong Tong, Yi Qing Cui, Tian Lai Li
Kang Shuhua [3] selected the optimal insulation materials and preservation materials in greenhouses by testing four kinds of insulation materials and two kinds of preservation materials.
Five typical walls have the same condition except the north walls with different materials and configurations.
Journal of Shanghai Jiaotong University Agricultural Science, 2008, 26(5): 343-350.
Study on energy-saving solar greenhouse wall materials and structure [J].
Journal of Shanghai Jiaotong University Agricultural Science, 2010, 26(6): 231-237.
Online since: January 2014
Authors: Mujibur M. Rahman, A.M. Nor
Imatani, Compaction and sintering characteristics of composite metal powder, Journal of Material Processing Technology. 63 (1997) 364-369
Hanejko, High density processing of high performance ferrous materials, International Journal of Powder Metallurgy 31 (1999) 9-17
Rahman, The study of warm metal powder compaction, Journal of the Institute of Materials Malaysia 1 (2003) 161-174
Shahida, The effect of lubrication in reducing net friction in warm powder compaction process, Journal of Materials Processing Technology 207 (2008) 118-124
Ghambari, On the combined effect of lubrication and compaction temperature on properties of iron-based p/m parts, Materials Science and Engineering A 437 (2006) 360-365
Online since: September 2013
Authors: Kui Zeng
The detail introduction of the two processing technique is described as follows: (1) Electrochemical machining: The principle of the electrochemical machining is putting the material which needs to process into the positive or negative pool of electrochemical decomposition pool[3]. (2) Mechanical cutting: With the development of CNC technology, mechanical cutting machining is the most commonly used processing method of machining.
Sutherland, "Finite element simulation of the orthogonal metal cutting process for qualitative understanding of the effects of crater wear on the chip formation process", Journal of Materials Processing Technology, Vol. 127, No. 3, pp. 309-324, 2007
[3] J Mackerle, "Finite element analysis and simulation of machining: an addendum: A bibliography (1996–2002)", International Journal of Machine Tools and Manufacture, Vol. 43, No. 1, pp. 103-114, 2006
Melkote, "Finite element analysis of the influence of tool edge radius on size effect in orthogonal micro-cutting process", International Journal of Mechanical Sciences, Vol. 49, No. 5, pp. 5, 2007.