Engineering Research
Materials Science
Engineering Series
Books by Keyword: Cavitation
Books
The world population keeps increasing, and this growth has enormously impacted the environment negatively. Researchers all over the world have continually seeking different ways by which the negative impact of the global increasing population can be minimized including developing new technologies to accommodate the high population. The use of plastic has increased, wastes are taking land spaces, which could be used for other purposes such as building and farming, water bodies are been polluted leading to poor access to portable water, and food shortage has been experienced in many communities. The research presented in this book cut across Machine Design, Technologies of Environmental Engineering and Bioprocessing, Materials and Technologies in Construction, Information and Communication Technologies, and Engineering and Project Management. These researches if implemented would go a long way in providing sustainable and lasting solutions to these challenges.
Volume is indexed by Thomson Reuters CPCI-S (WoS).
The volume is divided into the following chapters: Mechanisms of Superplasticity, Superplastic Materials, Design, Testing and Modelling, Processing, Industrial Applications. Altogether, the contents constitute a timely and invaluable guide to the state-of-the-art of superplasticity.
This volume covers various aspects of ultra-clean technology for the large-scale integration of semiconductors. These include cleaning and contamination control in both front-end-of-line (FEOL) and back-end-of-line (BEOL) processing, as well as cleaning for semiconductor photo-voltaic applications. Also covered are studies of general topics such as particle removal using acoustic enhancement, the removal of metallic contamination, pattern collapse of fine flexible and fragile features, wetting and drying, contamination control and contamination metrology. The FEOL and BEOL contributions also treat the surface chemistry of silicon and other semiconductors, cleaning related to new gate stacks, cleaning at the interconnect level, resist strip and polymer removal, cleaning and contamination control for various new materials and cleaning following CMP (chemical mechanical polishing).
The contents of this publication include every conceivable issue related to contamination, cleaning and surface preparation during mainstream large-scale integrated circuit manufacture. Typically, silicon is used as the main semiconductor substrate. However, other semiconducting materials such as SiGe and SiC are currently being used in the source-sink junction areas, and materials such as Ge and III-V compounds are being considered for the transistor channel region of future-generation devices.
This very special volume on ‘Advanced Structural and Functional Materials for Protection’ focuses on the choice of materials intended for the specific task of protecting civilians and soldiers against the effects of blast, fragmentation weapons and unconventional attacks, and also covers multi-functional materials intended for the enhancement of soldier performance. Protective materials represent one of the greatest challenges to synthesis and processing; due to the extreme requirements of the application.
This collection of 86 peer-reviewed papers covers all aspects of the use of ultra-clean technology for large-scale integration on semiconductors, and cleaning and contamination-control in both front-end-of-line (FEOL) and back-end-of-line (BEOL) processing.
This book is sub-divided into 10 different topical sections; each dealing with important issues in surface cleaning and preparation.