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Books by Keyword: Cutting
Books
Edited by:
Julong Yuan, Hitoshi Ohmori and Binghai Lv
Online since: April 2012
Description: Volume is indexed by Thomson Reuters CPCI-S (WoS).
The topics covered herein include: Single-point diamond turning; Ultra-precision grinding technology; High-speed and high-efficiency machining; Machine tools and systems; In-process measurement and monitoring; Metrology and evaluation; Finishing, lapping and polishing; Micro/nano machining and fabrication; Forming processes for optical and electrical components; CMP and silicon-wafer processing; Brittle-material machining; EDM, ultrasonic machining and laser machining; and Related precision machining methods. This work will provide a valuable and fruitful reference source for researchers in the field of ultra-precision machining who wish to understand, in greater depth, the underlying mechanisms and to create new and practical design technologies, systems and processes. It will also be particularly useful to practising engineers who are responsible for providing efficient, precise and effective machining.
The topics covered herein include: Single-point diamond turning; Ultra-precision grinding technology; High-speed and high-efficiency machining; Machine tools and systems; In-process measurement and monitoring; Metrology and evaluation; Finishing, lapping and polishing; Micro/nano machining and fabrication; Forming processes for optical and electrical components; CMP and silicon-wafer processing; Brittle-material machining; EDM, ultrasonic machining and laser machining; and Related precision machining methods. This work will provide a valuable and fruitful reference source for researchers in the field of ultra-precision machining who wish to understand, in greater depth, the underlying mechanisms and to create new and practical design technologies, systems and processes. It will also be particularly useful to practising engineers who are responsible for providing efficient, precise and effective machining.
Edited by:
Dunwen Zuo, Chuanzhen Huang, Ming Chen, Jun Li and Guo Hun
Online since: January 2012
Description: The present volume comprises peer-reviewed papers covering engineering/product/industrial design, manufacture and production, engineering materials, CAD/CAM/CAE, robotics, automation and control, sustainable technology , environment-friendly design and manufacture, web/internet technologies, artificial intelligence and smart computing in design and manufacture, enterprise management and other related topics. The content will be of great interest to production and research engineers, research students and academics.
Edited by:
P. J. Szabó and T. Berecz
Online since: September 2010
Description: This collection comprises state-of-the-art papers written by scientists and research groups working in fields encompassing metals and alloys, silicates, polymers and composites. The contents appear under the rubrics of: Classical Materials and Technologies – including the topics of Mechanical Engineering, Electrotechnics, Energetics, Ceramics, Polymers. Special Materials and Technologies – including Nanotechnology, Biotechnology and other Specialities. Modern Research and Characterization Methods. Modelling and Materials Informatics. Innovative Products and Technologies – including Industrial Applications, Technologies and Properties.
Edited by:
Yingxue Yao, Dunwen Zuo and Xipeng Xu
Online since: March 2010
Description: This collection of 142 papers was carefully selected from the more than 300 papers submitted. All of the papers were subjected to peer-review by at least two expert referees.
Edited by:
Fan Rui, Qiao Lihong, Chen Huawei, Ochi Akio, Usuki Hiroshi and Sekiya Katsuhiko
Online since: February 2009
Description: Volume is indexed by Thomson Reuters CPCI-S (WoS).
This special volume focuses on the current progress and trends in machining technologies. The objective was to harness and exchange experience, knowledge, new ideas and information concerning the latest developments in research pertaining to a wide range of subjects such as machining of novel, difficult-to-cut and free-machining materials, new tool materials and new abrasive tools, precision, micro and nano-machining, abrasive machining, high-speed machining, unconventional machining, new machine tools and tooling technology, and monitoring of the machining process.
This special volume focuses on the current progress and trends in machining technologies. The objective was to harness and exchange experience, knowledge, new ideas and information concerning the latest developments in research pertaining to a wide range of subjects such as machining of novel, difficult-to-cut and free-machining materials, new tool materials and new abrasive tools, precision, micro and nano-machining, abrasive machining, high-speed machining, unconventional machining, new machine tools and tooling technology, and monitoring of the machining process.
Edited by:
Tsunemoto Kuriyagawa, Libo Zhou, Jiwang Yan and Nobuhito Yoshihara
Online since: September 2008
Description: Volume is indexed by Thomson Reuters CPCI-S (WoS).
Abrasive technology concerns manufacturing processes that involve the use of abrasives in various forms. It has a long history; originating right from the first discovery of minerals. With increasingly stringent requirements for the production of high-precision and high surface-quality components, in applications such as silicon wafers for the semiconductor industry and optical lenses for the precision instrument industry, abrasive technology is becoming an increasingly important factor in precision manufacturing. An understanding of the mechanisms of abrasive technology ensures the soundness and integrity of current component manufacture, as well as leading to the development of new and effective techniques.
Abrasive technology concerns manufacturing processes that involve the use of abrasives in various forms. It has a long history; originating right from the first discovery of minerals. With increasingly stringent requirements for the production of high-precision and high surface-quality components, in applications such as silicon wafers for the semiconductor industry and optical lenses for the precision instrument industry, abrasive technology is becoming an increasingly important factor in precision manufacturing. An understanding of the mechanisms of abrasive technology ensures the soundness and integrity of current component manufacture, as well as leading to the development of new and effective techniques.