Books by Keyword: Data Mining (DM)

Description: These proceedings of the 2012 International Conference on Electrical Insulating Materials and Electrical Engineering (EIMEE 2012) are grouped into eight chapters: Materials Science and Engineering; Mechanical Engineering and Applied Mechanics; Electrical Machinery and Engineering; Data, Image and Signal Processing; Control Theory and Control Engineering; Communication and Networks; Information Engineering and Technology; Other Related Topics.

Description: The peer-reviewed papers brought together, in this special issue of Solid State Phenomena, are the outcome of the 16^th International Conference on Internal Friction and Mechanical Spectroscopy, ICIFMS-16, held on the 3rd to 8th July 2011, in Lausanne, Switzerland. These proceedings aim to attract newcomers to this exciting field of research and lead them to appreciate the potential of anelastic methodologies in the investigation of advanced materials and new phenomena. Scientist who are already involved in the field will also find within new ideas which will stimulate their interest in developing new experiments and theories.

Description: The 2011 International Conference on Mechatronics and Materials Engineering (ICMME 2011) was held on December 10-12th 2011 in Qiqihar, China. ICMME was initially founded by a network of researchers and engineers from both academia and industry who were working in the areas of mechatronics and materials science.
Volume is indexed by Thomson Reuters CPCI-S (WoS).
All of the accepted papers are to be found in this special volume, which addresses the hottest issues in mechatronics and materials. The volume covers a wide range of topics, including mechatronics materials, mechatronics, materials engineering, engineering mechanics, etc.

Description: These are the fully refereed proceedings of the International Conference on Materials Science and Information Technology (MSIT 2011), held during the 16-18 September 2011 in Singapore. The main goal of the event was to provide an international scientific forum for the exchange of new ideas in a number of fields by permitting in-depth interaction via discussions with peers from around the world. Core areas of materials science and information technology, plus multi-disciplinary and interdisciplinary aspects are covered.
Volume is indexed by Thomson Reuters CPCI-S (WoS).

Description: The object of this collection of peer-reviewed papers is to provide a forum for the discussion of new developments, recent progress and innovations in the design and implementation of MEMS, NANO and Smart Systems-on-Chip. It addresses all aspects of the design methodology of such systems, with the emphasis on current and future challenges in research and development in both academia and industry. The 983 papers are grouped into 22 chapters: Materials Behavior, Casting and Solidification, Surface, Subsurface and Interface Phenomena, Coatings and Surface Engineering, Composite Materials, Materials Forming, Machining, Nanomaterials and Nanomanufacturing, Biomedical Manufacturing, Environmentally Sustainable Manufacturing Processes and Systems, Manufacturing Process Planning and Scheduling, Meso/Micro-Manufacturing Equipment and Processes, Modeling, Analysis and Simulation of Manufacturing Processes, Computer-Aided Design, Manufacturing and Engineering, Semiconductor Materials Manufacturing, Laser-Based Manufacturing, Precision Molding Processes, Rapid Manufacturing Technologies, Nontraditional Manufacturing, Nanofabrication, Nanometrology and Applications, Metrology and Measurement, and Mechanical and Electronic Engineering Control. The huge volume of information makes this a veritable encyclopedia of the subject matter.
Volume is indexed by Thomson Reuters CPCI-S (WoS).

Description: Volume is indexed by Thomson Reuters CPCI-S (WoS).
This second collection on “Advanced Measurement and Test II” is dedicated to the electronic testing of devices, boards and systems; covering the complete cycle from design verification, design-for-testing, design-for-manufacturing, silicon de-bugging, manufacturing testing, system testing, diagnosis, failure analysis … and back to process and design improvement. This will be an invaluable guide to the topics.

Description: The goal of this collection was to gather together up-to-date knowledge from researchers in academia and industry, as well as end-uses, and also give them the opportunity to share ideas, problems and solutions related to the divers aspects of Computational Materials Science, Mechanical, Industrial and Manufacturing Engineering. The result is an up-to-date survey which should be essential reading for those interested in thesetopics.
Volume is indexed by Thomson Reuters CPCI-S (WoS).

Description: The 2011 International Conference on Materials Engineering for Advanced Technologies was held on May 5-6, 2011, in Singapore. The objective of the conference was to bring together researchers from academia and industry, as well as end-users, in order to share ideas, problems and solutions related to the multifaceted aspects of Materials Engineering for Advanced Technologies. The resultant timely overview will be appreciated by anyone involved in these fields.
Volume is indexed by Thomson Reuters CPCI-S (WoS).

Description: In this special collection of over 304 peer-reviewed papers, are to be found some original ideas and angles on every aspect of Automation, Communication, Architectonics and Materials. Researchers here exchange their innovative ideas and new perspectives. The book will provide invaluable guidance to scientists, physicists, chemists and teachers concerning the topics covered.
Volume is indexed by Thomson Reuters CPCI-S (WoS).

Description: Volume is indexed by Thomson Reuters CPCI-S (WoS).
The goal of this collection of peer-reviewed papers was to provide researchers from the fields of Information Science, Automation and Materials Systems with a forum for sharing new ideas, innovations and solutions. The 371 peer-reviewed papers are grouped into the chapters: 1: Information Science and Automation, 2: Industry and Computer Applications, 3: Network Technology and Materials Engineering, 4: Intelligent Information and Applications, 5: Information Systems, Automation and Control, 6: Materials Engineering, Information and Automation, 7: Programming, Image and Industrial Application. Overall, the contents provide a useful handbook on the field.