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Scalable Particle Removal for sub-5 nm Nodes

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Abstract:

Wet cleaning has become challenging as the feature size of semiconductor devices decreased to sub-5 nm nodes. One of the key challenges is removing various types and sizes of particles and contamination from complex and fragile 3D structures without pattern damage and film loss. Conventional physical cleaning methods, such as dual-fluid spray or megasonic cleaning, are being used for the particle removal process. However, in advanced device nodes, these methods induce pattern damage and film loss. In this paper, we describe a novel particle removal technology called Nanolift which uses a polymer film consisting of two organic resins with different functions and achieved high particle removal efficiency on various types and sizes of particles with no pattern damage and minimum film loss.

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Periodical:

Solid State Phenomena (Volume 314)

Pages:

222-227

DOI:

https://doi.org/10.4028/www.scientific.net/SSP.314.222

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Online since:

February 2021

Authors:

Yukifumi Yoshida*, Katsuya Akiyama, Song Zhang, Dai Ueda, Masaki Inaba, Hiroaki Takahashi

Keywords:

Particle Removal, Pattern Damage, Physical Cleaning, Polymer Film, Zeta Potential

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© 2021 Trans Tech Publications Ltd. All Rights Reserved

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