New Achievements on CVD Based Methods for SiC Epitaxial Growth

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Abstract:

The results of a new epitaxial process using an industrial 6x2” wafer reactor with the introduction of HCl during the growth have been reported. A complete reduction of silicon nucleation in the gas phase has been observed even for high silicon dilution parameters (Si/H2>0.05) and an increase of the growth rate until about 20 µm/h has been measured. No difference has been observed in terms of defects, doping uniformity (average maximum variation 8%) and thickness uniformity (average maximum variation 1.2 %) with respect to the standard process without HCl.

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[1] J.A. Cooper and A. Agarwal, Proceedings of the IEEE, Vol. 90, No. 6, June 2002, p.956.

Google Scholar

[2] A. R. Powell and L. B. Rowland, Proceedings of the IEEE, Vol. 90, No. 6, June 2002, p.942.

Google Scholar

[3] N. Karoda, K. Shibahara, W.S. Yoo, S. Nishino, H. Mastunami, Extended Abstract, 19 th Conference on Solid State Devices and Materials, Tokio, 1987, p.227.

Google Scholar

[4] A. Veneroni, F. Omarini, M. Masi, S. Leone, M. Mauceri, G. Pistone and G. Abbondanza, This proceedings, (2004).

Google Scholar

[5] G. Valente, C. Cavallotti, M. Masi, S. Carrà, J. Crystal Growth , 230(2001) 247.

Google Scholar

[6] C. Cavalotti and M. Masi, Silicon Epitaxy, (Semiconductors and Semimetals, Academic Press, San Diego, 2001), cap. 2, p.51.

Google Scholar

[7] M. Di Stanislao, G. Valente, S. Fascella, C. Spampinato, M. Masi, S. Carrà, J. Phys. IV, Pr4 (2002) p.121.

DOI: 10.1051/jp4:20020086

Google Scholar

[8] M. Di Stanislao, G. Valente, S. Fascella, M. Masi, S. Carrà, J.Y. Fei, S. Yarlagadda, Electrochem. Soc. Symp. Ser., 8 (2003) p.226.

Google Scholar