Investigation of Trace Metals Analyses of Dry Residue on Silicon Wafer Surfaces by TXRF and ICP-MS
p.75
p.75
Electrochemical Study for the Characterization of Wet Silicon Oxide Surfaces
p.81
p.81
Pre-Diffusion Cleaning Using Ozone and HF
p.85
p.85
Novel Back Side Processes for Copper and Pre-Lithography Cleans
p.89
p.89
Optimisations of SC-1 Conditions for Sub 0.18μm Technologies in an Industrial Environment
p.93
p.93
Reduced Water Consumption for Post Clean Treatment and Metal Ion Contamination on VLSI Structures
p.97
p.97
Post SiN Etching Cleaning During Copper and Low K Integration
p.101
p.101
Wet Preparation of Defect-Free Hydrogen-Terminated Silicon Wafer Surface and Its Characterization in Atomic-Scale
p.105
p.105
Detection and Identification of Organic Contamination on Silicon Substrates
p.111
p.111
Optimisations of SC-1 Conditions for Sub 0.18μm Technologies in an Industrial Environment
Abstract:
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Periodical:
Solid State Phenomena (Volumes 76-77)
Pages:
93-96
DOI:
Citation:
Online since:
January 2001
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© 2001 Trans Tech Publications Ltd. All Rights Reserved
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