For Libraries For Publication Open Access Downloads About Us Contact Us
Paper Titles
CuOX Films for NO2 Detection: Microstructural Characterization
p.133
Low Temperature (~300°C) Epitaxial Growth of SiGe by Liquid-Solid Coexisting Annealing of A-GeSn/Si(100) Structure
p.137
Optimization of BiFeO3MFIS Capacitors Doped Niobium by Using Taguchi Method
p.141
GaN MSM UV Sensor Using Multi-Layer Graphene Schottky Electrodes
p.146
Experimental Study on Temperature during Wire Saw Slicing
p.153
Vacuum-Free Continuous Fabrication for Forming Narrow Bus Wires
p.158
Analysis and Optimization of a Hydraulic-Feedback Proportional Throttlecartridge Valve
p.162
FEM-Based Modeling to Simulate Thermal Deformation Process for High-Speed Ball Screw Drive Systems
p.171
Optimal Control of the Passive and Novel Docking Mechanism
p.180

Experimental Study on Temperature during Wire Saw Slicing

Article Preview

Abstract:

Heat generated during wire saw slicing can cause silicon temperature raise and make silicon wafer warpage, especially for larger silicon wafers. In order to study the wire saw effect on silicon temperature during slicing process, three kinds of wire saw, mainly semi-fixed abrasive wire saw and traditional wire saw, are applied for slicing silicon ingot. In this paper, the thermocouple is used to measure the temperature of the silicon during wire saw slicing. The experiment results show that the temperature of the silicon increases along with the wire saw working direction and reaches maximum value near the outlet position of silicon. The temperature of the silicon sliced by semi-fixed abrasive wire saw is lower than that sliced by traditional wire saw.

You might also be interested in these eBooks
Quantum, Nano, Micro Technologies and Applied Researches View Preview

Info:

Periodical:

Applied Mechanics and Materials (Volume 481)

Pages:

153-157

DOI:

https://doi.org/10.4028/www.scientific.net/AMM.481.153

Citation:

Cite this paper

Online since:

December 2013

Authors:

Chun Yan Yao, Zong Hua Xu, Wei Zhang, Qiao Fang Zhang, Wei Peng*

Keywords:

Semi-Fixed Abrasive Wire Saw, Silicon Temperature, Temperature Measuring

Export:

RIS, BibTeX

Price:

Permissions CCC:

Request Permissions

Permissions PLS:

Request Permissions

Сopyright:

© 2014 Trans Tech Publications Ltd. All Rights Reserved

Share:

Citation:

* - Corresponding Author

References

[1] P. Ge: Diamond and abrasive abrasive engineering Vol. 157 (2006), p.12.

Google Scholar

[2] T. Yamada, M. Fukunaga, T. Ichikawa: Theoretical and Applied Mechanics Vol. 51 (2002), p.251.

Google Scholar

[3] S. Bhagavat，I. Kao: International Journal of Machine Tools & Manufacture Vol. 48 (2008) , p.95.

Google Scholar

[4] K. Gastinger, M. Hamdi: Photovoltaic International journal Vol. 52 (2009), p.49.

Google Scholar

[5] J. Q. Su: Guangdong University of Technology (2009), P10.

Google Scholar

[6] W. Peng, J. S. Wang, C.Y. Yao: China Mechanical Engineering Vol. 24(2013), p.1225.

Google Scholar

[7] C. Y. Yao, W. Peng, S.Y. Chen: Advances in Mechanical Engineering Vol. 2013, 628027.

Google Scholar

[8] J. S. Wang, C.Y. Yao, W. Peng: China Mechanical Engineering Vol. 24(2013), p.1146.

Google Scholar

[9] H. J. Möller, C. Funke, M. Rinio: Thin Solid Films Vol. 487(2005), p.179.

Google Scholar

[10] M. Bhagavat, V. Prasad, I. Kao: Journal of Tribology Vol. 122 (2000), p.394.

Google Scholar

[11] H. J. Möller: Advanced Engineering Materials Vol. 6 (2004), p.501.

Google Scholar

© 2025 Trans Tech Publications Ltd. All rights are reserved, including those for text and data mining, AI training, and similar technologies. For open access content, terms of the Creative Commons licensing CC-BY are applied.
Scientific.Net is a registered trademark of Trans Tech Publications Ltd.