Thermal Strength of Adhesion Bond

Vladimir I. Andreev; Robert A. Turusov

doi:10.4028/www.scientific.net/AMM.670-671.153

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HomeApplied Mechanics and MaterialsApplied Mechanics and Materials Vols. 670-671Thermal Strength of Adhesion Bond

Thermal Strength of Adhesion Bond

Abstract:

The article considers the one-dimensional problem of the destruction of the simplest model of adhesively engage consisting generally of the many plates, which are substrates (what are glued) and adhesives (glues). The ability of the model to resist to thermal impact without fracturing here conventionally called the thermal strength. The problem is solved in the elastic formulation.

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Periodical:

Applied Mechanics and Materials (Volumes 670-671)

Pages:

153-157

DOI:

https://doi.org/10.4028/www.scientific.net/AMM.670-671.153

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Online since:

October 2014

Authors:

Vladimir I. Andreev, Robert A. Turusov

Keywords:

Adhesion, Composite, Contact Layer, Elasticity, Glue, Shear Stresses, Thermal Strength

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References

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