Uniformity of Kinematic Trajectory with Wafer Driving Initiatively in Plane Lapping Process

Abstract:

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This paper analyses the kinetic trajectory of abrasives both in initiative driving mode and passive driving mode, and the uniformity of lapping trajectory of the two opposite drive modes is discussed, respectively. The imperative relation between the kinematic trajectory and the uniformity is researched in this paper, as well as the simulation of the lapping trajectory.

Info:

Periodical:

Advanced Materials Research (Volumes 102-104)

Edited by:

Guozhong Chai, Congda Lu and Donghui Wen

Pages:

555-558

DOI:

10.4028/www.scientific.net/AMR.102-104.555

Citation:

P. F. Gao et al., "Uniformity of Kinematic Trajectory with Wafer Driving Initiatively in Plane Lapping Process", Advanced Materials Research, Vols. 102-104, pp. 555-558, 2010

Online since:

March 2010

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Price:

$35.00

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