Uniformity of Kinematic Trajectory with Wafer Driving Initiatively in Plane Lapping Process

Peng Fei Gao; Wei Fang Wang; Dong Hui Wen

doi:10.4028/www.scientific.net/AMR.102-104.555

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Tool Path Generation Method of Equal Approximation Error for Free-Form Surface in High Speed Machining
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Overview of Rapid Prototyping for Fabrication of Bone Tissue Engineering Scaffold
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Uniformity of Kinematic Trajectory with Wafer Driving Initiatively in Plane Lapping Process
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The Characterization and Experiment Research of Ultrasonic Rolling Machining for Column Surface
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Applying TRIZ for Optimization Formulation of Sapphire Precision Lapping
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Path Generation and Posture Angle Control of Tool for Robotic Polishing System
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The Numerical Simulation of the Single Abrasive Motion Law in the Environment of Structural Surface
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Uniformity of Kinematic Trajectory with Wafer Driving Initiatively in Plane Lapping Process

Abstract:

This paper analyses the kinetic trajectory of abrasives both in initiative driving mode and passive driving mode, and the uniformity of lapping trajectory of the two opposite drive modes is discussed, respectively. The imperative relation between the kinematic trajectory and the uniformity is researched in this paper, as well as the simulation of the lapping trajectory.