Micro-Channel Mold Machined by Ultrafine WEDM

Yu Kui Wang; Xiang Chen; Bo Zhu; Zhen Long Wang

doi:10.4028/www.scientific.net/AMR.1049-1050.1026

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HomeAdvanced Materials ResearchAdvanced Materials Research Vols. 1049-1050Micro-Channel Mold Machined by Ultrafine WEDM

Micro-Channel Mold Machined by Ultrafine WEDM

Abstract:

In this study, an ultrafine WEDM (wire electrical discharge machining) of micro-channel mold is proposed. It could be divided into two parts, rough machining and finish processing. In rough machining procedure, high machining voltage is adopted to improve machining efficiency. In finish machining procedure, extended and trimmed tool path is adopted to obtain the cusp at the corner, low electrical parameters is adopted to improve surface quality and dimensional precision. By conducting finish machining of 40V, a better surface-quality with Ra of 0.32μm and high aspect ratio of 20:1 was fabricated.

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Periodical:

Advanced Materials Research (Volumes 1049-1050)

Pages:

1026-1029

DOI:

https://doi.org/10.4028/www.scientific.net/AMR.1049-1050.1026

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Online since:

October 2014

Authors:

Yu Kui Wang*, Xiang Chen, Bo Zhu, Zhen Long Wang

Keywords:

Finish Machining, Micro-Channel Mold, Rough Machining, Ultrafine WEDM

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* - Corresponding Author

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