The Stress Research during the HCPEB Treatment on the Thermal Barrier Coatings

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The 3-dimension temperature field mold is used to simulate the HCPEB treatment on the thermal barrier coating via Abaqus software. The stress distribution within the coating and the temperature variation during HCPEB treatment are simulated. It demonstrate that: with the outer energy increasing,the temperature distribution along with the vertical direction decreases: with the outer energy vanishing and the mold cooling down,the surface cools down first while the inner part of the coatings increases,then the inner energy releases through the surface and the whole mold cools down to the room temperature. The rate of temperature to time could reach 106 K/s-107 K/s. The stress decreases first and then increases along with the vertical direction of the coatings. The surface stress decreases at first, then rebounds to 0.5MPa and finally come to a stable value.

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381-388

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October 2014

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© 2014 Trans Tech Publications Ltd. All Rights Reserved

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