A Review on the CMP of SiC and Sapphire Wafers
Chemo-mechanical polishing (CMP) has been a useful method to produce superior brittle wafer surfaces. This paper reviews the CMP of silicon carbide and sapphire wafers, focusing on efficiency of the polishing rate. The effects of slurry type, slurry pH value and mixed abrasives will be discussed in detail.
Yunn-Shiuan Liao, Chao-Chang A. Chen, Choung-Lii Chao and Pei-Lum Tso
Y. G. Wang and L. C. Zhang, "A Review on the CMP of SiC and Sapphire Wafers", Advanced Materials Research, Vols. 126-128, pp. 429-434, 2010