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Effect of Operated Parameters on Removal Rate and Surface Roughness in Precision Atomization Ultra-Polishing Process of Copper Surface

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Abstract:

Compared with the traditional chemical mechanical polishing (CMP) technique, the precision atomization ultra-polishing (PAUP) technology has the advantages of friendly environmental and damage-free. This paper established a novel PAUP tester based on the atmospheric pressure theory, and explored the possibility of PAUP technique. Furthermore, effects of operated parameters on the material removal rate and surface roughness were investigated in PAUP process. It was found that a material removal rate of 78.302 nm/min was obtained with a surface roughness of 0.015 µm at the optimal parameters. This study provides insight into the development of the novel ultra-polishing methods and its underlying theoretical foundation.

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Periodical:

Advanced Materials Research (Volumes 189-193)

Pages:

4141-4144

DOI:

https://doi.org/10.4028/www.scientific.net/AMR.189-193.4141

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Cite this paper

Online since:

February 2011

Authors:

Qing Zhong Li, Yong Guang Wang, Zhi Xue Guo, Dong Ming Guo

Keywords:

CMP, Fine Atomization, Polishing Slurry

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© 2011 Trans Tech Publications Ltd. All Rights Reserved

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