Preparation, Characterization and Infrared Emissivity Properties of Cu / Polyurethane Composite

Article Preview

Abstract:

By the addition of flake Cu particles to polyurethane the infrared emissivity of polymers can be decreased significantly. In this work, the flake copper particles were prepared by solution phase reduction method. The PU pre-polymer was prepared by a typical method which using polyether polyol N220 and tolylene diisocyanate (TDI). Cu/Polyurethane composite was prepared by using incorporation method. The structure and morphology of Cu particles and Cu/Polyurethane composite were characterized by Fourier transform infrared spectrum spectroscopy (FTIR), scanning electron microscope (SEM), X-ray diffraction (XRD) and Energy Dispersive X-ray Detector (EDS). Moreover, the effects of copper particles content on infrared emissivity properties of composite were studied too. The results show that the flake Cu particles were prepared and dispersed well in polyurethane matrix. The infrared emissivity of composite was decreased with increasing particles loading. The composites get lowest infrared emissivity 0.546 when the loading of fillers increased to 20%.

You might also be interested in these eBooks

Info:

Periodical:

Advanced Materials Research (Volumes 197-198)

Pages:

483-486

Citation:

Online since:

February 2011

Export:

Price:

Permissions CCC:

Permissions PLS:

Сopyright:

© 2011 Trans Tech Publications Ltd. All Rights Reserved

Share:

Citation:

[1] Yucong You, Shiguo Du, Dongmei Shi, et al. Modern Paint&Finishing. Vol. 16 (2006), p.50 in chinese.

Google Scholar

[2] Zueco J, Alhama F. J Quantitative Spectroscopy and Radiative Transfer. Vol. 101 (2006), p.73.

Google Scholar

[3] Weidong Zhang, Xiaoyun Feng, Aerospace Materials&Technology. Vol. 30 (2000), p.1 in chinese.

Google Scholar

[4] BiswasPK, DeA, PramanikN C. J. MaterLett. Vol. 57 (2003), p.2326.

Google Scholar

[5] Wenlan Xu, Ningsheng Luo, Min Zhang, et al. Infrared Research. Vol. 9 (1990), p.384 in chinese.

Google Scholar

[6] Chou K S, Lu Y C. J. The Solid Films. Vol. 515 (2007), p.7217.

Google Scholar

[7] AokiT, Hatanaka Y, Look D C. J. Appl Phys Lett. Vol. 76 (2000), p.3257.

Google Scholar

[8] Xu DH, DengZ B, XuY, eta. l. J. Phys LettA. Vol. 76 (2005), p.148.

Google Scholar

[9] Shan Y, Zhou Y M, Cao Y, et a. l. J. MaterLett. Vol. 58 (2004), p.1655.

Google Scholar