Thermal Stability of Cu/Si (111) Films Prepared by Ionized Cluster Beam Technique

Abstract:

Article Preview

The Cu films were deposited on P type Si (111) substrates by ionized cluster beam (ICB) technique. The interface reaction and atomic diffusion of Cu/Si (111) system were studied at different annealing temperatures by X-ray diffraction (XRD) and Rutherford backscattering spectrometry (RBS). Some significant results were obtained: For the Cu/Si (111) samples prepared by ionized cluster beams at Va=3 kV, the interdiffusion of Cu and Si atoms occurred in the as deposited samples. The RBS spectra features were changed with a very small extent with increasing the annealing temperature. There are no copper-silicide phases observed by XRD before and after being annealed at different temperatures. The reason may be that there is a thermally stable interface between Cu films and Si substrates formed.

Info:

Periodical:

Advanced Materials Research (Volumes 287-290)

Edited by:

Jinglong Bu, Pengcheng Wang, Liqun Ai, Xiaoming Sang, Yungang Li

Pages:

2369-2372

DOI:

10.4028/www.scientific.net/AMR.287-290.2369

Citation:

B. Cao et al., "Thermal Stability of Cu/Si (111) Films Prepared by Ionized Cluster Beam Technique", Advanced Materials Research, Vols. 287-290, pp. 2369-2372, 2011

Online since:

July 2011

Export:

Price:

$35.00

In order to see related information, you need to Login.

In order to see related information, you need to Login.