Silicon Microfabrication Processes Including Anodic Bonding of Extremely Thin (60 μm –Thick) Silicon on Glass

Takayuki Nara; Kouki Oku; Hirofumi Fukai; Hideki Hatagouchi; Yasushiro Nishioka

doi:10.4028/www.scientific.net/AMR.306-307.180

Paper Titles

Growth and Photovoltaic Performance of Single-Crystal TiO₂ Nanorod Array Directly on Transparent Conducting Substrates
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Synchrotron Radiation X-Ray Absorption and Optical Studies of Cubic SiC Films Grown on Si by Chemical Vapor Deposition
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Luminescence in Rare Earth Activated AlPO₄ Phosphor
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Synthesis and Photoluminescence of Cr-Doped Rod-Like ZnO Particles by Hydrothermal Method
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Silicon Microfabrication Processes Including Anodic Bonding of Extremely Thin (60 μm –Thick) Silicon on Glass
p.180

Characteristics of Gamma–Ray Irradiated Pentacene Organic Thin Film Field Effect Transistors
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Fabrication of Condenser Microphones on Silicon on Insulator Wafer
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Influence of the Quality of AlN Buffer Layer on the Quality of GaN Epitaxial Layer on Silicon Substrate
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Two Novel Tetrahedrally Silicon-Based Benzimidazole Derivatives: Potentials as Blue Emitters for OLEDs
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HomeAdvanced Materials ResearchAdvanced Materials Research Vols. 306-307Silicon Microfabrication Processes Including...

Silicon Microfabrication Processes Including Anodic Bonding of Extremely Thin (60 μm –Thick) Silicon on Glass

Abstract:

A new silicon MEMS process has been proposed utilizing anodic bonding of an extremely thin silicon film (60 m) on a glass substrate, followed by photo lithographically defining micro spring structures on the silicon film and dry etching the silicon film using an inductively coupled plasma (ICP) dry etcher. After that, the underneath glass was selectively etched off using a hydrofluoric (HF) solution to release the micro spring. This technique was successfully applied to a micro vibration detection sensor with the silicon microspring with a cross section of 10 m x 60 m with a length longer than 500 m.

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Periodical:

Advanced Materials Research (Volumes 306-307)

Pages:

180-184

DOI:

https://doi.org/10.4028/www.scientific.net/AMR.306-307.180

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Online since:

August 2011

Authors:

Takayuki Nara, Kouki Oku, Hirofumi Fukai, Hideki Hatagouchi, Yasushiro Nishioka

Keywords:

Anodic Bonding, Micro-Electromechanical System (MEMS), Sensor, Silicon Film

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