Microstructural Evolution during Accumulative Roll-Bonding Process of a High Performance Copper Alloy

Seong Hee Lee; Daejin Yoon; Hiroshi Utsunomiya

doi:10.4028/www.scientific.net/AMR.378-379.597

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HomeAdvanced Materials ResearchAdvanced Materials Research Vols. 378-379Microstructural Evolution during Accumulative...

Microstructural Evolution during Accumulative Roll-Bonding Process of a High Performance Copper Alloy

Abstract:

Microstructural evolution of a copper alloy processed by accumulative roll-bonding (ARB) was investigated by EBSD analysis. The grains became thinner and elongated to the rolling direction with increasing the number of ARB cycles. The subdivision of the grains to the rolling direction actively begins to occur after 5 cycles of the ARB, resulting in formation of ultrafine grains with small aspect ratio. After 8 cycles, the ultrafine grained structure with the average grain diameter of 250nm developed in almost whole regions of the sample. In addition, the fraction of high-angle grain boundaries increased with the number of ARB cycles and reached about 0.7 after 8 cycles. The texture development of the ARB processed samples was different depending on the number of ARB cycles and the positions in the thickness.

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Periodical:

Advanced Materials Research (Volumes 378-379)

Pages:

597-600

DOI:

https://doi.org/10.4028/www.scientific.net/AMR.378-379.597

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Online since:

October 2011

Authors:

Seong Hee Lee, Daejin Yoon, Hiroshi Utsunomiya

Keywords:

Accumulative Roll Bonding (ARB), Copper, Electron Back Scatter Diffraction, Ultra-Fine Grain (UFG)

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