Study on the Preparation and Properties of Copper Nanoparticles and their Nanofluids

Yang Li; Hua Qing Xie; Ji Feng Wang; Wei Yu

doi:10.4028/www.scientific.net/AMR.399-401.606

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HomeAdvanced Materials ResearchAdvanced Materials Research Vols. 399-401Study on the Preparation and Properties of Copper...

Study on the Preparation and Properties of Copper Nanoparticles and their Nanofluids

Abstract:

Nanoscale copper particles were synthesized by chemical reduction with polyvinyl pyrrolidone as dispersant, ascorbic acid as reduction agent, copper sulfate pentahydrate and ammonia as reagent. X-ray diffraction (XRD) analysis revealed that as-prepared copper nanoparticle was well crystallized without other impurities. Transmission electron microscopy (TEM) displayed that nanoscale coppers had homogenous distribution and the particle size was about 30~50 nm. Uniform and stable Cu-nanofluids were prepared by general stirring, high speed shear stirring and ultrasonic, with water/ethylene glycol as base fluid and as-synthesized copper nanoparticles as additives. The thermal conductivity of Cu-nanofluid was measured by a short-hot wire method. The results showed that the thermal conductivity of Cu-nanofluid was increased 8~9% compared to base fluid and the temperature had little effect on the enhancement of the thermal conductivity.

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Periodical:

Advanced Materials Research (Volumes 399-401)

Pages:

606-609

DOI:

https://doi.org/10.4028/www.scientific.net/AMR.399-401.606

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Online since:

November 2011

Authors:

Yang Li, Hua Qing Xie, Ji Feng Wang, Wei Yu

Keywords:

Chemical Reduction, Copper Nanoparticle, Nanofluid, Thermal Conductivity (TC)

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