The Study on Microstructure and Thermal Expansion Property of SiCp/Al-30Si Composite Material Prepared by Hot-Pressing

Abstract:

The SiCp/Al-30Si composite material was prepared by hot-pressing. The microstructure was characterized by means of optical microscope and SEM, the thermal expansion performance was tested by PYC-Ⅲ Thermal Expansion Coefficient Tester. It was researched that the influence of SiC particle size and manufacture technology on the microstructure and thermal expansion coefficient. Results show that shortening soaking time decreases the number and the size of the nascent and precipitating Si particles, enlarges the CTE of the composite; lager pressure is beneficial to reduce the CTE of the composite, and the larger the pressure is, the more compact microstructure is and the less number of holes are. Thermal expansion performance of the composite was influenced by SiC particle size, distribution of matrix phase, trait of interface combination and the holes.

• Periodical: Advanced Materials Research (Volumes 490-495)
• Pages: 3859-3863
• DOI: https://doi.org/10.4028/www.scientific.net/AMR.490-495.3859
• Online since: March 2012
• Authors: Ai Qin Wang, Ming Fang, Jing Pei Xie, Zeng Lei Ni, Li Jun Zhang
• Keywords: Hot-Pressing, SiC/Al-30Si Composite Materials, Thermal Expansion

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