Simulation Analysis of Springback for Lead Frame Copper Alloy

Juan Hua Su; Feng Zhang Ren; Ze Yang

doi:10.4028/www.scientific.net/AMR.560-561.1048

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HomeAdvanced Materials ResearchAdvanced Materials Research Vols. 560-561Simulation Analysis of Springback for Lead Frame...

Simulation Analysis of Springback for Lead Frame Copper Alloy

Abstract:

The bending performance of lead frame materials is a very important in improving the quality of lead frame alloys and meeting the needs of high performance integrated circuit. The sringback amount of curvature variation of CuFeP , CuCrZrMg , CuNiSi and CuCrSnZn alloy are researched by numerical simulation. Bending model is built by 3D modeling software, and the necessary post-processing is carried out. The bending springback amount △K of the four kinds of copper alloy materials are calculated out. The results show that the sringback amount of curvature variation of four copper alloys at the same condition from large to small in turn is CuCrZrMg, CuNiSi, CuFeP, CuCrSnZn. Smaller the minimum relatively bending radius of copper alloy used in lead frame, less the springback amount and better the forming performance.

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Periodical:

Advanced Materials Research (Volumes 560-561)

Pages:

1048-1051

DOI:

https://doi.org/10.4028/www.scientific.net/AMR.560-561.1048

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Online since:

August 2012

Authors:

Juan Hua Su, Feng Zhang Ren, Ze Yang

Keywords:

Bending Springback, Copper Alloy, Finite Element Analysis (FEA), Lead Frame

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