Investigation into Cu-Interlayered Diffusion Bonding Trial of AZ31B Alloy

Abstract:

For effective bonding of Magnesium alloy, Cu foil was used as the interlayer to conduct the diffusion bonding experiment of AZ31B alloy. The microstructure and properties of the diffusion bonding joint was analyzed by means of SEM, EDS and micro-hardness tester. Experiment results show that compact bonding joint was obtained at the temperature of 480°C, holding time of 30 minutes, pressure of 10 MPa and the vacuum degree of 1.0×10^-2Pa. The bonding joint consists of a interfacial diffusion region which is a mixture of Mg₂Cu, MgCu₂, and Mg(Cu) solid solution, and the transitional zone which is composed of Mg(Cu,Al) solid solution base and Mg₁₇(Al, Cu)₁₂ phase. Within the bonding joint,the micro-hardness shows a step pattern of increasing, which is well accord with the the microstructural feature of the joint.This trial has prove that using Cu as the interlayer is effective to improve the quality of the AZ31B bonding joint.

• Periodical: Advanced Materials Research (Volumes 631-632)
• Pages: 167-171
• DOI: https://doi.org/10.4028/www.scientific.net/AMR.631-632.167
• Online since: January 2013
• Authors: Wei Xiang Zhang, Shuang Min Du
• Keywords: Copper Foil Layer, Diffusion Bonding, Magnesium Alloy, Microstructure

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