Modeling the Minimum Chip Thickness in Orthogonal Micro-Cutting Based on Plastic Strain Gradient

Ji Hua Wu; Zhan Qiang Liu

doi:10.4028/www.scientific.net/AMR.69-70.203

Paper Titles

Masked and Unmasked Machining of Glass by Micro Abrasive Jet
p.182

Research on Material Removal Characteristics of Nanoparticle Colloid Jet Machining
p.187

A Survey of the Machining Characteristics and Mechanical Polishing Technology of CVD Diamond Films
p.192

Mould Machining of Structural Surface Based on Liquid-Solid Two Phase Abrasive Flow
p.198

Modeling the Minimum Chip Thickness in Orthogonal Micro-Cutting Based on Plastic Strain Gradient
p.203

Investigation of Material Removal and Grain Wear Mechanism in Single Point Diamond Scratching Tests on SiC
p.209

Experimental Study on Parameter Optimization of Silicon Wafer CMP Using Composite Abrasives Slurry
p.214

Electrochemical Micro Machining of Stainless Steel with Voltage Pulses
p.219

Study on Semi-Fixed Abrasive Lapping of Ultra-Thin Silver Electrode Layer
p.225

HomeAdvanced Materials ResearchAdvanced Materials Research Vols. 69-70Modeling the Minimum Chip Thickness in Orthogonal...

Modeling the Minimum Chip Thickness in Orthogonal Micro-Cutting Based on Plastic Strain Gradient

Abstract:

In micro-cutting, the uncut chip thickness is comparable or even less than the tool edge radius and as a result a chip will not be generated if the uncut chip thickness is less than a critical value, viz., the minimum chip thickness. Knowledge of the minimum chip thickness plays a key role of the selection of appropriate machining conditions and optimization the micro-cutting processes. An analytical model is developed to predict the minimum chip based on the strain gradient plasticity theory in this paper, and the model accounts for the effect of material property in micro-scale such as the shear modulus, intrinsic length scale, fracture toughness and the Burgers vector. Predicted results are validated by experimental data obtained from the orthogonal micro-cutting experiments.