Study on Semi-Fixed Abrasive Lapping of Ultra-Thin Silver Electrode Layer

Xun Lv; Ju Long Yuan

doi:10.4028/www.scientific.net/AMR.69-70.225

Paper Titles

Modeling the Minimum Chip Thickness in Orthogonal Micro-Cutting Based on Plastic Strain Gradient
p.203

Investigation of Material Removal and Grain Wear Mechanism in Single Point Diamond Scratching Tests on SiC
p.209

Experimental Study on Parameter Optimization of Silicon Wafer CMP Using Composite Abrasives Slurry
p.214

Electrochemical Micro Machining of Stainless Steel with Voltage Pulses
p.219

Study on Semi-Fixed Abrasive Lapping of Ultra-Thin Silver Electrode Layer
p.225

Fabrication of Micro-Structures by Micro-ECM
p.229

Study of Good Yield and Efficiency in TFT-LCD Module Process
p.234

Test Research on Grinding Performance of the New Grinding Fluid in Power Ultrasonic Honing
p.238

Experimental Research on UV Laser and High-Pressure Water-Assisted YAG Laser Dicing SiC Wafer
p.243

HomeAdvanced Materials ResearchAdvanced Materials Research Vols. 69-70Study on Semi-Fixed Abrasive Lapping of Ultra-Thin...

Study on Semi-Fixed Abrasive Lapping of Ultra-Thin Silver Electrode Layer

Abstract:

Silver electrode layer of piezoelectric ceramic transducer requires good surface quality and high efficiency. Efficiency of traditional lapping and polishing is very low. Ultra-precision grinding technology is also unsuitable for the thickness of workpiece is extremely thin. Semi bonded abrasive lapping is a new ultra-precision processing method. The new ultra-precise method can achieve good surface quality in short time, and removal stock of workpiece is small. In order to research the optimal technology of semi bonded abrasive lapping about silver electrode layer, this paper research several major processing parameters by experiments. The results show that appropriate processing load can obtain better surface roughness of silver electrode layer，and surface roughness of silver electrode layer has little change with different processing speed. By using ultra-fine semi bonded abrasive plate, 94.08KPa processing load and 40 rpm polishing speed, after 30 minutes, surface roughness of silver electrode layer is 11nm, and removal stock is 11.5μm.