Investigation of Material Removal and Grain Wear Mechanism in Single Point Diamond Scratching Tests on SiC

Abstract:

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There has been increased interest in the use of SiC due to its excellent physical and mechanical properties. The diamond grinding process of SiC has been largely investigated in recent years, but the interface between diamond grain and SiC in grinding has not been completely understood. In this paper, a single diamond scratching method was presented in order to insight into the interface realizing on a SRV friction and abrasion test machine using three types of diamond grains with different shapes. The results analysis for material removal and diamond grain wear mechanisms in the interacting between the diamond grain and SiC can be useful to improve the grinding process of SiC.

Info:

Periodical:

Advanced Materials Research (Volumes 69-70)

Edited by:

Julong Yuan, Shiming Ji, Donghui Wen and Ming Chen

Pages:

209-213

DOI:

10.4028/www.scientific.net/AMR.69-70.209

Citation:

Q.L. Zhao and J.Y. Chen, "Investigation of Material Removal and Grain Wear Mechanism in Single Point Diamond Scratching Tests on SiC", Advanced Materials Research, Vols. 69-70, pp. 209-213, 2009

Online since:

May 2009

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$35.00

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