Microwave Dielectric Properties and its Compatibility with Silver of Glass-Ceramic Based on Co-Fire at Low Temperature

Article Preview

Abstract:

Low temperature co-fired glass-ceramic-Ag metal electrode systems were investigated in relation to Ag diffusion and micro structural development during firing. Sintering temperature was in a range of 800°C-900°C. At lower temperature of 800°C, Ag ion was diffused through in the LTCC substrates. However, Ag diffusion was not observed at 850°C below. Simultaneously, the densification of the electrode was greatly improved. With increasing sintering temperature, glass-ceramic to the electrode does not occur due to increase of the densification of the sample. The glass-ceramics exhibited good dielectric properties: εr=7.74, tanδ=0.7×10-3 at 850°C for 0.5h.

You might also be interested in these eBooks

Info:

Periodical:

Pages:

167-172

Citation:

Online since:

June 2013

Authors:

Export:

Price:

Permissions CCC:

Permissions PLS:

Сopyright:

© 2013 Trans Tech Publications Ltd. All Rights Reserved

Share:

Citation:

[1] H.K. Zhu, H.Q. Zhou. Preparation and properties of low-temperature co-fired ceramic of CaO-SiO2-B2O3 system [J]. Mater Sci: Mater Electron,17 (2006) 637-641.

DOI: 10.1007/s10854-006-0011-6

Google Scholar

[2] C. Bienert, A. Roosen. Characterization and improvement of LTCC composite materials for application at elevated temperatures [J].Journal of the European Ceramic Society, 30 (2010) 369-374.

DOI: 10.1016/j.jeurceramsoc.2009.05.023

Google Scholar

[3] P. Bembnowicz, L.J. Golonka. Integration of transparent glass window with LTCC technology for uTAS application [J].Journal of the European Ceramic Society, 30 (2010) 743-749.

DOI: 10.1016/j.jeurceramsoc.2009.08.025

Google Scholar

[4] O. Dernovsek, A. Naeini, G. Preu, W. Wersing, M, et al. LTCC glass-ceramic composites for microwave application. Journal of the European Ceramic Society, 21 (2001) 1693-1697.

DOI: 10.1016/s0955-2219(01)00096-6

Google Scholar

[5] A. Bittner, H. Seidel, U. Schmid. Electro migration resistance and long term stability of textured silver thin films on LTCC [J]. Microelectronic Engineering, 88 (2011) 127-130.

DOI: 10.1016/j.mee.2010.09.018

Google Scholar

[6] Cynthia S.M-C, Nuria I-G, Francisco V, Julian Alonso. LTCC micro flow analyzers with monolithic integration of thermal control[J].Sensors and Actuators A, 138 ( 2007) 63-70.

DOI: 10.1016/j.sna.2007.04.059

Google Scholar

[7] B. Hansu, M. Thomas, R. Peter. Processing of graphite-based sacrificial layer for micro fabrication of low temperature co-fired ceramics (LTCC) [J].Sensors and Actuators A, 130-131 (2006) 560-567.

DOI: 10.1016/j.sna.2005.12.009

Google Scholar

[8] M. Hrovat , D. Belavi , J. Kita , J. Cilensek, et al. Thick-film temperature sensors on alumina and LTCC substrates[J].Journal of the European Ceramic Society, 25 (2005) 3443-3450.

DOI: 10.1016/j.jeurceramsoc.2004.09.027

Google Scholar

[9] Y.F. Zhang, S.L. Bai, M. Miao, Y.F. Jin.Microstructure and mechanical properties of an alumina-glass low temperature co-fired ceramic[J]. Journal of the European Ceramic Society,29 (2009) 1077-1082.

DOI: 10.1016/j.jeurceramsoc.2008.07.056

Google Scholar

[10] Q.L. Zhang, H. Yang, H.P. Sun. A new microwave ceramic with low-permittivity for LTCC applications [J].Journal of the European Ceramic Society, 28 (2008) 605-609.

DOI: 10.1016/j.jeurceramsoc.2007.07.003

Google Scholar

[11] S. Lee, M. Park, S. Hwang, H. Kim. Shape change of Ag electrode with shrinkage difference between electrode and dielectric in PDP [J].Displays, 29 (2008) 345-350.

DOI: 10.1016/j.displa.2007.10.004

Google Scholar

[12] Y.G. Wang, G.N. Zhang, J.S. Ma. Research of LTCC/Cu, Ag multilayer substrate in microelectronic packaging [J].Materials Science and Engineering B, 94 (2002) 48-53.

DOI: 10.1016/s0921-5107(02)00073-9

Google Scholar

[13] M. Eberstein, T. Rabe, W.A. Schiller. Influences of the Glass Phase on Densification, Microstructure, and Properties of Low-Temperature Co-Fired Ceramics [J].International journal of Applied Ceramic Technology, 6 (2006) 428-436.

DOI: 10.1111/j.1744-7402.2006.02108.x

Google Scholar

[14] C.L. Miao, M. Wang, Z.X Yue, et al. Co-firing behavior of ZnTiO3 dielectric ceramics/Ag composites for MLCCs. Ceramics International, 32 (2006) 471-474.

DOI: 10.1016/j.ceramint.2005.03.025

Google Scholar

[15] C. S. Hsi, F.M. Hsieh, H.P. Chen. Characteristics of thick film resistors embedded in low temperature co-fired ceramic (LTCC) substrates [J].Journal of the European Ceramic Society, 27 (2007) 2779-2784.

DOI: 10.1016/j.jeurceramsoc.2006.11.013

Google Scholar

[16] H. Birol, T. Maeder, P. Ryser. Induction materials on properties of co-fired resistors in LTCC structures [J]. Journal of the European Ceramic Society, 26 (2006) 1937-1941.

DOI: 10.1016/j.jeurceramsoc.2005.09.030

Google Scholar