Kinetic Analysis of UV-Curable Epoxy Resins for Micromachining Applications

Voytekunas Vanda Yu; Ng Feng Lin; Koh Chai Ling; Abadie Marc

doi:10.4028/www.scientific.net/AMR.74.299

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Kinetic Analysis of UV-Curable Epoxy Resins for Micromachining Applications
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HomeAdvanced Materials ResearchAdvanced Materials Research Vol. 74Kinetic Analysis of UV-Curable Epoxy Resins for...

Kinetic Analysis of UV-Curable Epoxy Resins for Micromachining Applications

Abstract:

Multifunctional epoxy resin series Epiclon HP-7200 is classified under the high performance series and is well known for its application in electrical encapsulation as it exhibits excellent mechanical and electrical properties. In addition, they have an advantage of an ultra low moisture absorption compared to other conventional cresol novolac (ECN) and biphenyl epoxy resins, which potentially makes it the next new mainstream of epoxy resins in electronics application. In this paper, kinetic study of various concentration of Epiclon HP-7200 (40-70 wt %) with divinyl ether (DVE) as the reactive solvent has been performed by Photo-Differential Scanning Calorimetry (DPC). The thermal stability of the Epiclon HP-7200 solutions has been analyzed by DSC and TGA.