Examination of Thermal Parameters, Primary Dendritic Spacings and Microhardness of a Horizontally Solidified Al-Cu-Mg Ternary Alloy

Abstract:

In this paper, the Al-3wt.%Cu-0.5wt.%Mg alloy was grown by the transient horizontal directional solidification method in a water cooled stainless steel chill. A temperature monitoring system in the metal was used and the registered time-temperature data during the solidification process were applied to determine tip growth rates (V_L) and cooling rates (T_R) which have been correlated with both primary dendrite arm spacings (λ₁) and Vickers microhardness (HV). Characterization techniques by optical and scanning electron microscopy (OM and SEM) were employed and the observed microstructures show an Al-rich dendritic matrix (a-Al) and θ (Al₂Cu) and S (Al₂CuMg) intermetallic phases within the interdendritic regions. Power and Hall-Petch type experimental equations were proposed to describe the HV profile as a function of the thermal and microstructural parameters (V_L, T_R, and λ₁). In order to investigate the effect of the Mg alloying, a comparative analysis was also performed between the experimental values of this article and the results of previous studies carried out with the Al-3wt.%Cu binary alloy.

• Periodical: Defect and Diffusion Forum (Volume 379)
• Pages: 133-139
• DOI: https://doi.org/10.4028/www.scientific.net/DDF.379.133
• Online since: November 2017
• Authors: A.S. Barros*, M.N. Collyer, Adrina P. Silva, A.L. Moreira, O.L. Rocha
• Keywords: Al-3wt.%Cu-0.5wt.%Mg Alloy, Dendritic Spacings, Micro-Hardness, Solidification, Thermal Parameters

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