Annealing Behavior and Kinetics of Primary Recrystallization of Copper

A. Morozova; A. Dolzhenko; M. Odnobokova; Alexander P. Zhilyaev; Andrey Belyakov; Rustam Kaibyshev

doi:10.4028/www.scientific.net/DDF.385.343

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HomeDefect and Diffusion ForumDefect and Diffusion Forum Vol. 385Annealing Behavior and Kinetics of Primary...

Annealing Behavior and Kinetics of Primary Recrystallization of Copper

Abstract:

The microstructure evolution during the annealing treatment of a recycled copper after cold rolling to total strain of 2.6 was investigated. The cold deformation resulted in the elongation of initial grains along rolling direction and the strain-induced formation of subboundaries. Annealing recovery occurred in the temperature range 100-250 °C. The recrystallized microstructures were observed after annealing at 300-400 °C. The hardness of partially recrystallized copper samples was interpreted in terms of dislocation strengthening. The recrystallization kinetics was estimated according to a Johnson–Mehl–Avrami–Kolmogorov equation using different methods for recrystallized fraction determination, i.e., the fractional softening, the grain orientation spread, and the Kernel average misorientation.

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Periodical:

Defect and Diffusion Forum (Volume 385)

Pages:

343-348

DOI:

https://doi.org/10.4028/www.scientific.net/DDF.385.343

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Online since:

July 2018

Authors:

A. Morozova*, A. Dolzhenko, M. Odnobokova, Alexander P. Zhilyaev, Andrey Belyakov, Rustam Kaibyshev

Keywords:

Copper, EBSD-Analysis, Grain Refinement, Primary Recrystallization, Recovery

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