Paper Titles
Preface
Optimization of Defect Localization in Ultrasonic Images of CFRP Multidirectional Plates Based on Complex Geometry
p.3
Rice Husk Fiber-Based Polishing Pad for Chemical Mechanical Polishing (CMP) of Sapphire
p.17
Influence of Filler on the Interfacial Strength between TPE and PP Composites
p.23
A Preliminary Investigation on Recycled PET-Derived Polyurethane Films: Role of NCO/OH Ratio in Film Development
p.33
Structural Study of Modified-Recycled PET from Drinking Bottle Waste by Using Multifunctional Chain Extenders
p.41
Effects of Plasticizers on Physical and Mechanical Properties of Tamarind Kernel Powder-Gelatin Film
p.51
TiO₂-Chitosan Functionalized Polypropylene Nonwovens for Air Filtration Applications
p.59
Process Design and Optimisation of Parameters for the Production of Energy from Wood Biomass via Pyrolysis
p.69

Rice Husk Fiber-Based Polishing Pad for Chemical Mechanical Polishing (CMP) of Sapphire

Article Preview

Abstract:

This research aims to study the properties of polishing pads made from polyurethane mixed with rice husk fiber for use in chemical mechanical polishing (CMP) of sapphire. After cleaning and sizing, the rice husk fiber was modified using hydrochloric acid (HCl). Then, both unmodified and modified rice husk fibers were mixed with polyurethane at ratios of 7.5, 10, and 12.5 phr to form polishing pads. The hardness and polishing performance of these pads in sapphire CMP were then tested. The experimental results showed that polishing pads from rice husk fiber could be successfully formed and remained stable. The natural fibers were evenly distributed across the contact surface of the pads. The hardness of polishing pads from rice husk fiber was smaller than conventional polishing pad (SUBA800) in range of 40.5–47.5%. Polishing results revealed that pads made from polyurethane mixed with unmodified and modified rice husk fiber achieved the highest material removal rates (MRR) of 94.2% and 64.7%, respectively, compared to the conventional pad. These results indicate that both types of fibers able to be used as a material for manufacturing polishing pads for adding value and reducing the waste from the agricultural.

You might also be interested in these eBooks
Heat and Mass Transfer, Thermal Engineering, Advanced Materials and Energy Conversion View Preview

Info:

Periodical:

Defect and Diffusion Forum (Volume 447)

Pages:

17-22

DOI:

https://doi.org/10.4028/p-Mjsob8

Citation:

Cite this paper

Online since:

February 2026

Authors:

Sethavut Duangchan, Natthaphon Bun-Athuek*, Mighttho Ketsuwan, Muhammad Mudden, Panart Khajornrungruang, Keisuke Suzuki

Keywords:

Hydrochloric Acid, Polishing Pad, Polyurethane, Rice Husk, Sapphire

Export:

RIS, BibTeX

Price:

Permissions CCC:

Request Permissions

Permissions PLS:

Request Permissions

Сopyright:

© 2026 Trans Tech Publications Ltd. All Rights Reserved

Share:

Citation:

* - Corresponding Author

References

[1] H. Wang, Z. Lin, J. Han, L. Zhong and G. Li, Design of patterned sapphire substrates for GaN-based light-emitting diodes, Chinese Phys. B. 24 (2015) 067103.

DOI: 10.1088/1674-1056/24/6/067103

Google Scholar

[2] N. Xin-huan, L. Yu-ling, T. Bai-mei, H. Li-ying and Z. Jian-xin, Method of surface treatment on sapphire substrate, Trans. Nonferrous. Met. Soc. China. 16 (2006) s732-s734.

Google Scholar

[3] J. Wang, B. Guo, Q. Zhao, C. Zhang, Q. Zhang, H. Chen and J. Sun, Dependence of material removal on crystal orientation of sapphire under cross scratching, J. Eur. Ceram. Soc. 37 (2017) 2465-2472.

DOI: 10.1016/j.jeurceramsoc.2017.01.032

Google Scholar

[4] C. Park, H. Kim, S. Lee and H. Jeong, The Influence of Abrasive Size on High-Pressure Chemical Mechanical of Sapphire Wafer, Int. J. Pr. Eng. Man-Gt. 2 (2015) 157-162.

DOI: 10.1007/s40684-015-0020-0

Google Scholar

[5] H. Lei and K. Tong, "Preparation of La-doped colloidal SiO2 composite abrasives and their chemical mechanical polishing behavior on sapphire substrates," Pre. Eng. 44 (2016) 124-130.

DOI: 10.1016/j.precisioneng.2015.10.009

Google Scholar

[6] M. Uneda, K. Takano, K. Koyama, H. Aida and K. Ishikawa, Investigation into Chemical Mechanical Polishing Mechanism of Hard-to-Process Materials Using a Commercially Available Single-Sided Polisher, Int. J. of Autom. Technol. 9 (2015) 573-579.

DOI: 10.20965/ijat.2015.p0573

Google Scholar

[7] E. A. Vovk, A. T. Budnikov, M. V. Dobrotvorskaya, S. I. Krivonogov and A. Ya. Dan'ko, Mechanism of the interaction between Al2O3 and SiO2 during the chemical-mechanical polishing of sapphire with silicon dioxide, J. Surf. Investig. 6 (2012) 115-121.

DOI: 10.1134/s1027451012020188

Google Scholar

[8] M. Bahr, Y. Sampurno, R. Han and A. Philipossian, Slurry Injection Schemes on the Extent of Slurry Mixing and Availability during Chemical Mechanical Planarization, Micromachines. 8 (2017) 170 - 182.

DOI: 10.3390/mi8060170

Google Scholar

[9] M. Ketsuwan, N. Bun-Athuek, N. Sukhawipat, S. Boripatkosol, C. Parung, Study on mechanical properties of rice husk fiber-based polishing pad for chemical mechanical polishing of sapphire substrate, 2024 1st International Conference on Robotics, Engineering, Science, and Technology (RESTCON), Pattaya, Thailand, 2024, pp.214-217.

DOI: 10.1109/restcon60981.2024.10463580

Google Scholar

[10] S. Natsa, J. O. Akindapo and D. K. Garba, Development of a military helmet using coconut fiber reinforced polymer matrix composite, EJ-Eng 3 (2015) 55-65.

Google Scholar

[11] Y. Cui, X Niu, J. Zhou, Z. Wang, R. Wnag and J. Zhang, Effect of Chloride Ions on the Chemical Mechanical Planarization Efficiency of Sapphire Substrate, ECS J. Solid State Sci. Technol. 8 (2019) 488-495.

DOI: 10.1149/2.0161909jss

Google Scholar