Investigation of Bamboo Powder Self-Adhesive Molding Method Using Semiconductor Laser for Additive Manufacturing

Abstract:

The purpose of this study is to explore the use of laser additive manufacturing of bamboo powder to produce items with fewer variations than the traditional heat press method using a die. Although metal and resin powders are commonly used in powder additive manufacturing, bamboo powder presents unique challenges owing to its lack of material uniformity, low carbonization temperature, and dependence on pressure for adhesion. To address these issues, the appropriate laser power and irradiation time were determined by irradiating the laser at several power levels and examining its effects on the powder temperature and chemical changes during molding. The results indicated that rapid heating occurred at approximately 150 °C, and carbonization began at approximately 190 °C. As the energy loss for carbonization decreases with increasing laser power, this method is expected to be effective for producing bamboo products with fewer variations. In addition, restriction of continuous oxygen inflow by the glass plate lid makes it feasible to prevent heat generation and carbonization. Furthermore, pressurization by the glass plate makes it feasible to improve adhesion. Future research will focus on the suppression of carbonization by inert gas and heating at low temperatures for long periods of time, as well as the effects of different magnitudes of pressure on the process.

• Periodical: Key Engineering Materials (Volume 1012)
• Pages: 107-113
• DOI: https://doi.org/10.4028/p-rhrH8o
• Online since: May 2025
• Authors: Kaito Tanaka*, Reo Kitazaki, Nakahara Yutaro, Masao Nakagawa, Toshiki Hirogaki, Eiichi Aoyama, Hiromichi Nobe
• Keywords: Additive Manufacturing, Bamboo, Binder-Less, Green Material, Laser, Lignocellulose

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