Fracture Mechanics Parameters Governing Delaminated Interfaces in IC Packages Subjected to Unsteady Thermal Stress

Kenji Machida; Mamtimin Gheni; Hiroyuki Okamura

doi:10.4028/www.scientific.net/KEM.243-244.393

Paper Titles

Development and Application of the Strain Energy Density Criterion to Three-Dimensional I-II Mixed-Mode Fracture
p.369

Stress Intensity Factors for Interaction between Interface Crack and Internal Crack and for Kinked Interface Crack in Bonded Semi-Infinite Planes
p.375

Dynamic Ductile Fracture Toughness Test and Numerical Simulation for Ultra-High Pressure Gas Pipelines
p.381

FEM Analysis of a Crack in a Bimaterial Plate Based on the Crack Tip Stress Method
p.387

Fracture Mechanics Parameters Governing Delaminated Interfaces in IC Packages Subjected to Unsteady Thermal Stress
p.393

Experimental Observation of Final Void Volume Fraction at Fracture in Constrained Metal Matrix Composites
p.399

The Void Size Effect in Metallic Materials
p.405

Damage Identification Based Simulations for a Class of Nonlinear Structures
p.411

Tension-Dependent Internal Damping of a Cable Model
p.415

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Fracture Mechanics Parameters Governing Delaminated Interfaces in IC Packages Subjected to Unsteady Thermal Stress

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Key Engineering Materials (Volumes 243-244)

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393-398

DOI:

https://doi.org/10.4028/www.scientific.net/KEM.243-244.393

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Online since:

July 2003

Authors:

Kenji Machida, Mamtimin Gheni, Hiroyuki Okamura

Keywords:

Delamination Interface, Finite Element Model (FEM), Modified Crack-Closure Integral, Strain Energy Release Rate (SERR), Virtual Crack Extension Method

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References

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