Fracture Mechanics Parameters Governing Delaminated Interfaces in IC Packages Subjected to Unsteady Thermal Stress

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Periodical:

Key Engineering Materials (Volumes 243-244)

Edited by:

Mamtimin Geni and Masanori Kikuchi

Pages:

393-398

DOI:

10.4028/www.scientific.net/KEM.243-244.393

Citation:

K. Machida et al., "Fracture Mechanics Parameters Governing Delaminated Interfaces in IC Packages Subjected to Unsteady Thermal Stress", Key Engineering Materials, Vols. 243-244, pp. 393-398, 2003

Online since:

July 2003

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$35.00

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