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HomeKey Engineering MaterialsKey Engineering Materials Vol. 248Effect of Ho Amount on Microstructure and...

Effect of Ho Amount on Microstructure and Electrical Properties of Ni-MLCC

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Electroceramics in Japan VI

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Periodical:

Key Engineering Materials (Volume 248)

Pages:

183-186

DOI:

https://doi.org/10.4028/www.scientific.net/KEM.248.183

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Online since:

August 2003

Authors:

Hirokazu Chazono, Hiroshi Kishi

Keywords:

Barium Titanate (BT), Grain Boundary, Grain Growth, HALT, I-t Characteristics, I-V Characteristic, Ni-MLCC

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© 2003 Trans Tech Publications Ltd. All Rights Reserved

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