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Preparation of Ag-Pd Alloy Particles by Ultrasonic Spray Pyrolysis and Application to Electrode for LTCC
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Control of Texture in Electroceramics by Slip-Casting in a High Magnetic Field
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Development of Particle Assembling Technology by Using Micro-Electrophoretic Deposition Process
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Effect of High-Voltage Screening on Titania Ceramics with Different Surface Finishing
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HomeKey Engineering MaterialsKey Engineering Materials Vol. 248Development of Particle Assembling Technology by...

Development of Particle Assembling Technology by Using Micro-Electrophoretic Deposition Process

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Electroceramics in Japan VI

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Periodical:

Key Engineering Materials (Volume 248)

Pages:

195-198

DOI:

https://doi.org/10.4028/www.scientific.net/KEM.248.195

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Online since:

August 2003

Authors:

Jun Ichi Hamagami, Kazuhiro Hasegawa, Kiyoshi Kanamura

Keywords:

Electrophoretic Deposition Process, Micro-Counter Electrode, Microdot, Patterning, Polystyrene Sphere, Silica Sphere, Spherical Particle Assembly

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© 2003 Trans Tech Publications Ltd. All Rights Reserved

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