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HomeKey Engineering MaterialsKey Engineering Materials Vols. 257-258A Study on the Dressing Rate in CMP Pad...

A Study on the Dressing Rate in CMP Pad Conditioning

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Advances in Abrasive Technology VI

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Periodical:

Key Engineering Materials (Volumes 257-258)

Pages:

377-382

DOI:

https://doi.org/10.4028/www.scientific.net/KEM.257-258.377

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Online since:

February 2004

Authors:

Pei Lum Tso, S.Y. Ho

Keywords:

Chemical Mechanical Polishing (CMP), Dressing Rate, Pad Conditioning

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© 2004 Trans Tech Publications Ltd. All Rights Reserved

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[1] W. Li, D.W. Shin, M. Tomozawa and S.P. Murarka: Thin Solid Films, 1995, p.601.

[2] J. Sung, Y.L. Pai: Advances in Abrasive Technology III, The Society of Grinding Engineers, 2000, p.189.