A Study on the Dressing Rate in CMP Pad Conditioning

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Periodical:

Key Engineering Materials (Volumes 257-258)

Edited by:

Thomas Pearce, Yongsheng Gao, Jun'ichi Tamaki and Tsunemoto Kuriyagawa

Pages:

377-382

Citation:

P. L. Tso and S.Y. Ho, "A Study on the Dressing Rate in CMP Pad Conditioning", Key Engineering Materials, Vols. 257-258, pp. 377-382, 2004

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February 2004

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[1] W. Li, D.W. Shin, M. Tomozawa and S.P. Murarka: Thin Solid Films, 1995, p.601.

[2] J. Sung, Y.L. Pai: Advances in Abrasive Technology III, The Society of Grinding Engineers, 2000, p.189.