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A Study of the Characteristics of the Diamond Dresser in the CMP Process
p.371

A Study on the Dressing Rate in CMP Pad Conditioning
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Pad Surface Characterization and its Effect on the Tribological State in Chemical Mechanical Polishing
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Chemical and Mechanical Characterizations of the Passivation Layer of Copper in Organic Acid Based Slurries and its CMP Performance
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A Study of an Ultra-Precision CNC Polishing System
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Pressure-Based Grinding and Polishing of Free-Form Lenses with Spherical Tools
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Effect of Pre-Thin-Surface Grinding on Copper Chemical Mechanical Polishing
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A Study on the Manufacture of the Next Generation CMP Pad with a Uniform Shape Using the Micro-Molding Method
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A New Process for Internal Polishing of Cemented Carbide Using a Vibrating Tool with Two-Dimensional Small Motions
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HomeKey Engineering MaterialsKey Engineering Materials Vols. 257-258A Study of an Ultra-Precision CNC Polishing System

A Study of an Ultra-Precision CNC Polishing System

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Advances in Abrasive Technology VI

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Periodical:

Key Engineering Materials (Volumes 257-258)

Pages:

395-400

DOI:

https://doi.org/10.4028/www.scientific.net/KEM.257-258.395

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Online since:

February 2004

Authors:

S.J. Han, J.K. Choi, Seok Woo Lee, Hon Jong Choi

Keywords:

Corrective Polishing, Dwell Time, On-Machine Measurement (OMM)

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© 2004 Trans Tech Publications Ltd. All Rights Reserved

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