A Study on the Manufacture of the Next Generation CMP Pad with a Uniform Shape Using the Micro-Molding Method

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Periodical:

Key Engineering Materials (Volumes 257-258)

Edited by:

Thomas Pearce, Yongsheng Gao, Jun'ichi Tamaki and Tsunemoto Kuriyagawa

Pages:

413-416

Citation:

J. Y. Choi et al., "A Study on the Manufacture of the Next Generation CMP Pad with a Uniform Shape Using the Micro-Molding Method", Key Engineering Materials, Vols. 257-258, pp. 413-416, 2004

Online since:

February 2004

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[1] H. Hocheng, Y.L. Huang and L.J. Chen: J. of Electrochem. Soc., Vol. 146 (1999), p.4236.

[2] J.M. Steigwald: Chemical Mechanical Planarization of Microelectronic Materals (Elsevier, NY 1987).

[3] J.Y. Choi, H.Y. Kim, J.H. Park, H.D. Jeong and H.D. Seo: Key Engineering Materials, Vol. 238-239 (2003), p.247.