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HomeKey Engineering MaterialsKey Engineering Materials Vols. 257-258A Study on the Manufacture of the Next Generation...

A Study on the Manufacture of the Next Generation CMP Pad with a Uniform Shape Using the Micro-Molding Method

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Advances in Abrasive Technology VI

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Periodical:

Key Engineering Materials (Volumes 257-258)

Pages:

413-416

DOI:

https://doi.org/10.4028/www.scientific.net/KEM.257-258.413

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Online since:

February 2004

Authors:

Jae Young Choi, Hwan Kim, J. Park, S. Chung, Hae Do Jeong, M. Kinoshita

Keywords:

Chemical Mechanical Polishing (CMP), CMP, Micro Molding Method, Polishing Pad, Self-Conditioning

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© 2004 Trans Tech Publications Ltd. All Rights Reserved

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[1] H. Hocheng, Y.L. Huang and L.J. Chen: J. of Electrochem. Soc., Vol. 146 (1999), p.4236.

[2] J.M. Steigwald: Chemical Mechanical Planarization of Microelectronic Materals (Elsevier, NY 1987).

[3] J.Y. Choi, H.Y. Kim, J.H. Park, H.D. Jeong and H.D. Seo: Key Engineering Materials, Vol. 238-239 (2003), p.247.