A Study on the Manufacture of the Next Generation CMP Pad with a Uniform Shape Using the Micro-Molding Method

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Periodical:

Key Engineering Materials (Volumes 257-258)

Edited by:

Thomas Pearce, Yongsheng Gao, Jun'ichi Tamaki and Tsunemoto Kuriyagawa

Pages:

413-416

DOI:

10.4028/www.scientific.net/KEM.257-258.413

Citation:

J. Y. Choi et al., "A Study on the Manufacture of the Next Generation CMP Pad with a Uniform Shape Using the Micro-Molding Method", Key Engineering Materials, Vols. 257-258, pp. 413-416, 2004

Online since:

February 2004

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$35.00

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