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HomeKey Engineering MaterialsKey Engineering Materials Vols. 257-258Chemical and Mechanical Characterizations of the...

Chemical and Mechanical Characterizations of the Passivation Layer of Copper in Organic Acid Based Slurries and its CMP Performance

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Advances in Abrasive Technology VI

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Periodical:

Key Engineering Materials (Volumes 257-258)

Pages:

389-394

DOI:

https://doi.org/10.4028/www.scientific.net/KEM.257-258.389

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Online since:

February 2004

Authors:

Dae Hong Eom, J.S. Ryu, Jin Goo Park, J.J. Myung, Kyung Su Kim

Keywords:

Complexing Agent, Copper CMP, Cu CMP Slurry, Oxidant, Passivation Layer

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© 2004 Trans Tech Publications Ltd. All Rights Reserved

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[1] J.M. Steigerwald, S.P. Murarka and R.J. Gutmann: Chemical Mechanical Planarization of Microelectronic Materials (Wiley Interscience, NY 1996).

[2] S. Kondo, N. Sakuma, Y. Homma and N. Ohashi: Proc. of Electrochemical Processing in ULSI Fabrication I and Interconnect and Contact Metallization, California, Vol. 98 (1998), p.195.

[3] V. Nguyen, H. VanKranenburg and P. Woerlee: Journal of Microelectronic Engineering, Vol. 50 (2000), p.403.

[4] T.A. Ring: Fundamentals of Ceramic Power Processing and Synthesis (Academic Press, San Diego 1996).

[5] L. Zhang, S. Raghavan, S. Meikle and G. Hudson: J. Electrochem. Soc., Vol. 146 (1999), p.1442.

[6] J. McMurry: Organic Chemistry (Brooks/Cole Publishing Company, California 1988).

[7] P.A. Shamlou: Processing of Solid-Liquid Suspensions (Butterworth-Heinemann Ltd., Oxford 1993).

[8] K. Utani, T. Suzuki and S. Adach: J. Appl. Phys., Vol. 73 (1993).