Chemical and Mechanical Characterizations of the Passivation Layer of Copper in Organic Acid Based Slurries and its CMP Performance

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Periodical:

Key Engineering Materials (Volumes 257-258)

Edited by:

Thomas Pearce, Yongsheng Gao, Jun'ichi Tamaki and Tsunemoto Kuriyagawa

Pages:

389-394

Citation:

D. H. Eom et al., "Chemical and Mechanical Characterizations of the Passivation Layer of Copper in Organic Acid Based Slurries and its CMP Performance", Key Engineering Materials, Vols. 257-258, pp. 389-394, 2004

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February 2004

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