A Study of the Characteristics of the Diamond Dresser in the CMP Process

Yunn Shiuan Liao; P.W. Hong; C.T. Yang

doi:10.4028/www.scientific.net/KEM.257-258.371

Paper Titles

Application of Air Cooling Technology and Minimum Quantity Lubrication to Relief Grinding of Cutting Tools
p.345

Potential of the Electro Contact Discharge Dressing Method in Truing and Sharpening Super Abrasive Grinding Wheels
p.353

A Study on Laser Cleaning of Al₂O₃ Grinding Wheels
p.359

Comparison of Laser Cleaning of Al₂O₃ and CBN Grinding Wheels
p.365

A Study of the Characteristics of the Diamond Dresser in the CMP Process
p.371

A Study on the Dressing Rate in CMP Pad Conditioning
p.377

Pad Surface Characterization and its Effect on the Tribological State in Chemical Mechanical Polishing
p.383

Chemical and Mechanical Characterizations of the Passivation Layer of Copper in Organic Acid Based Slurries and its CMP Performance
p.389

A Study of an Ultra-Precision CNC Polishing System
p.395

HomeKey Engineering MaterialsKey Engineering Materials Vols. 257-258A Study of the Characteristics of the Diamond...

A Study of the Characteristics of the Diamond Dresser in the CMP Process

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Key Engineering Materials (Volumes 257-258)

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371-376

DOI:

https://doi.org/10.4028/www.scientific.net/KEM.257-258.371

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Online since:

February 2004

Authors:

Yunn Shiuan Liao, P.W. Hong, C.T. Yang

Keywords:

CMP, Diamond Dresser, Dressing Rate, Pad Conditioner

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References

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