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HomeKey Engineering MaterialsKey Engineering Materials Vols. 257-258Pad Surface Characterization and its Effect on the...

Pad Surface Characterization and its Effect on the Tribological State in Chemical Mechanical Polishing

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Advances in Abrasive Technology VI

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Periodical:

Key Engineering Materials (Volumes 257-258)

Pages:

383-388

DOI:

https://doi.org/10.4028/www.scientific.net/KEM.257-258.383

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Online since:

February 2004

Authors:

Hyoung Jae Kim, Hae Do Jeong, E. Lee, Y. J. Shin

Keywords:

Chemical Mechanical Polishing (CMP), Friction, Pad, Surface Roughness (SR), Tribology

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© 2004 Trans Tech Publications Ltd. All Rights Reserved

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[1] J.M. Steigerwald, S.P. Muraka and R.J. Gutmann: Chemical Mechanical Planarizationof Microelectronic Materials (Wiley-Interscience, Newyork 1997).

[2] S.R. Wilson, C.J. Tracy and J.L. Freeman: Handbook of Multilevel Metallization for Integrated Circuits (Noyes Publication, Park Ridge 1993).

[3] Y. Obeng et al: Chemical Mechanical Planarization V - Electrochemical Society Proceedings, Vol. 1 (2002), p.13.

[4] B. Bhushan: Principles and Applications of Tribology (John Wiley & Sons, NY 1999).

[5] J. Coppeta, C. Rogers, L. Racz, A. Philipossian and F.B. Kaufman: J. of Electrochem. Soc., Vol. 147 (2000), p.1903.

[6] H.J. Kim, D.H. Kwon, H.D. Jeong, E.S. Lee and Y.J. Shin: 9th International Chemical-Mechanical Planarization for ULSI Multilevel Interconnetion Conference, CMP-MIC, 2002, p.201.

[7] K.L. Johnson: Contact Mechanics (Cambridge University Press, Cambridge 1987).

[8] T.K. Yu, C.C. Yu and M. Orlowski: IEDM 93, 1993 p.865.

[9] Anon: Mitutoyo SJ-301 User’s Manual (Mitutoyo).

[10] D.J. Whitehouse, Handbook of Surface Metrology (Institute of Physics Publishing, Bristol 1994).

[11] D. Wang, J. Lee, K. Holland, T. Bibby, S. Beaudoin and T. Cale: J. of Electrochem. Soc., Vol. 14 (1997), p.1121.

[12] H.J. Kim, H.Y. Kim, H.D. Jeong, E.S. Lee and Y.J. Shin: J. of Materials Processing Technology, Vol. 130 (2002), p.334. 1 10 0.2 0.4 0.6 0.8 1.0 1.2 1.4 50 20 5 2 Normalized Uniformity of pad wear theoretical Normalized Uniformity of RR Experimental Polishing time(min) uniformity of removal rate 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 uniformity of pad wear

DOI: 10.1143/jjap.47.7812