Effect of Pre-Thin-Surface Grinding on Copper Chemical Mechanical Polishing

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Periodical:

Key Engineering Materials (Volumes 257-258)

Edited by:

Thomas Pearce, Yongsheng Gao, Jun'ichi Tamaki and Tsunemoto Kuriyagawa

Pages:

407-412

Citation:

J. Watanabe et al., "Effect of Pre-Thin-Surface Grinding on Copper Chemical Mechanical Polishing", Key Engineering Materials, Vols. 257-258, pp. 407-412, 2004

Online since:

February 2004

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[1] L. Young: Solid State Technology, 2000, p.111.

[2] Y. Homma: J. Electrochem. Soc., Vol. 147 (2000), p.1193.

[3] J. Watanabe et al: Proc. of the third International Conference on Abrasive Technology, 1999, p.187.

[4] T. Yoshida: The Electrochem. Soc. Honolulu Meeting, Abs. No. 1288 (1999).

[5] D. Dornfeld: Proc. of VLSI Mutilevel Interconnection Conference, 2000, p.379. Fig. 11 Surface roughness curve of copper film ground with type 1 grinding wheel.