Effect of Pre-Thin-Surface Grinding on Copper Chemical Mechanical Polishing

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Periodical:

Key Engineering Materials (Volumes 257-258)

Edited by:

Thomas Pearce, Yongsheng Gao, Jun'ichi Tamaki and Tsunemoto Kuriyagawa

Pages:

407-412

DOI:

10.4028/www.scientific.net/KEM.257-258.407

Citation:

J. Watanabe et al., "Effect of Pre-Thin-Surface Grinding on Copper Chemical Mechanical Polishing", Key Engineering Materials, Vols. 257-258, pp. 407-412, 2004

Online since:

February 2004

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Price:

$35.00

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