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HomeKey Engineering MaterialsKey Engineering Materials Vols. 257-258Effect of Pre-Thin-Surface Grinding on Copper...

Effect of Pre-Thin-Surface Grinding on Copper Chemical Mechanical Polishing

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Advances in Abrasive Technology VI

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Periodical:

Key Engineering Materials (Volumes 257-258)

Pages:

407-412

DOI:

https://doi.org/10.4028/www.scientific.net/KEM.257-258.407

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Online since:

February 2004

Authors:

Junji Watanabe, Tohru Hisamatsu, M. Hirano

Keywords:

Copper Chemical Mechanical Polishing, Flexible Diamond Disk, Planarization, Step Height, Surface Waviness, Thin Surface Grinding

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© 2004 Trans Tech Publications Ltd. All Rights Reserved

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[1] L. Young: Solid State Technology, 2000, p.111.

[2] Y. Homma: J. Electrochem. Soc., Vol. 147 (2000), p.1193.

[3] J. Watanabe et al: Proc. of the third International Conference on Abrasive Technology, 1999, p.187.

[4] T. Yoshida: The Electrochem. Soc. Honolulu Meeting, Abs. No. 1288 (1999).

[5] D. Dornfeld: Proc. of VLSI Mutilevel Interconnection Conference, 2000, p.379. Fig.11 Surface roughness curve of copper film ground with type 1 grinding wheel